Electronics Forum: delamination under component (Page 10 of 91)

Re: IR /Convection Preheats

Electronics Forum | Tue Jan 12 15:11:20 EST 1999 | Earl Moon

| | I have an Electrovert UPK 660c fitted with IR preheats top and bottom. We assemble a large range of multilayer backplanes and I was wondering if there are any advantages in changing to convection preheats.Has anybody got any views on the subject.

Re: Reflow soldering a Flexi-Rigid pcb

Electronics Forum | Sun Apr 05 09:46:47 EDT 1998 | Earl Moon

| We are looking at reflow soldering some Flexi-rigid | pcbs. I have heard that IR reflow soldering can make the Polyimide "self heat" and cause de-lamination. | Does anyone have any info. The thermal problems associated with polyimide rigid/flex de

Solder Shorts Under SMT Resistors/Capacitors

Electronics Forum | Tue Sep 21 08:43:28 EDT 1999 | Christopher Cross

We are finding solder shorts under 1206 Components on the bottom side of our boards.In all cases these shorts are from either side of the component to a feed-thru under the component body. Adhesive is used to glue down the component and then the boar

Re: haloing on SMT PCBs

Electronics Forum | Mon Jun 08 15:00:08 EDT 1998 | Earl Moon

| I work QA at an OEM in Alberta, Canada. I saw earlier posts on the smtnet regarding PCB haloing criteria. I am currently in a dispute with my PCB vendor over the acceptability of haloing (delamination) around plated through holes and vias on a lot

Need Expert Support - Popcorning

Electronics Forum | Wed Mar 14 11:51:24 EST 2001 | fmonette

Popcorning is the common designation for defects related to the moiture sensitivity of plastic molded components, like PBGAs. The plastic body of these parts will absorb moisture from the ambiant atmosphere on your factory floor. If a critical level

Re: IR Versus Hot Air - Put-Up Your Dukes

Electronics Forum | Tue Sep 28 04:16:18 EDT 1999 | Brian

| | | | | Jackie's posting recently and responses to it got me to dondering. First, recollecting, we bought an IR rework station a couple million years ago. It had a IR source on a stand, a bunch of lenses, and Reynolds aluminum foil for shielding

Re: BGA Inspection Criteria

Electronics Forum | Sun Dec 10 11:55:16 EST 2000 | Bob Willis

The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)

Re: BGA Inspection Criteria

Electronics Forum | Sun Dec 10 11:55:28 EST 2000 | Bob Willis

The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)

Re: BGA Inspection Criteria

Electronics Forum | Sun Dec 10 11:56:05 EST 2000 | Bob Willis

The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)

Cleaning under, around, and through tight spaces

Electronics Forum | Tue Jan 05 15:36:53 EST 1999 | Earl Moon

A question for you all! Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. My question concerns cleaning under, through, and around tight spaces. Way back when, we could not clean under 20 mil pitch


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