Electronics Forum: design guidelines (Page 10 of 32)

LGA36 6.5 x 3.5 mm

Electronics Forum | Sat Mar 31 08:22:42 EDT 2007 | davef

Are you observing stencil design rules with regard to aspect and area ratios? For more: * IPC-7525 - Stencil Design Guidelines * A previous discussion http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=24848 * Other postings on stencil ratio

Minimum lead pitch to avoid bridging

Electronics Forum | Thu Jul 05 08:11:45 EDT 2007 | naynayno

This is wave soldering process and design question since most folks associated with SMT are processing mixed assemblies. We have a 3-leaded sensor (radial) with such a tight pitch always bridges. Solutions unders disussion are pre-forming and addin

Trace Distance to Board Edge

Electronics Forum | Mon Jul 30 14:23:04 EDT 2007 | davef

So, now you know the tolerance that you and the board fab have in the area of the score line. For more, look at: * Accusystems [accusystemscorp.com] site scoring section for their FAQ. * Merix [Merix.com]: Designing For Manufacturability (DFM) Manua

via under a smd pad ?

Electronics Forum | Fri Nov 09 10:15:27 EST 2007 | devajj

Of course if you are an OEM you could go back to your design engineers and tell them via's in SMD pads is unacceptable. Put that in your DFM design guidelines. If you are an EMS provider you can also influence your customer by explaining the impa

Re: Accepting Stencils

Electronics Forum | Mon Nov 27 17:23:56 EST 2000 | Dave F

Thanks guys. Following on Cal's point ... we ordered a recently released IPC guideline, seeking closure. 7525 - Stencil Design Guidelines This new document provides guides for the design and fabrication of stencils for solder paste and surface-mou

Fine Pitch Stencil Design

Electronics Forum | Thu Dec 08 03:18:51 EST 2005 | khp_armin

Please give me some guidelines on designing Stencils for Fine Pitch.

Re: Accepting Stencils

Electronics Forum | Tue Nov 21 15:49:01 EST 2000 | CAL

Dave- this may not be much current help but for future needs: IPC-7525 Stencil Design Guidelines is due out real soon. Check with IPC on its status, last I heard it was in interim Final.What is nice about this Doccument is that it also covers Pin_Thr

PQFP with pitch of 0.4 mm

Electronics Forum | Tue Jan 30 21:14:26 EST 2001 | davef

Suggestions are: * Limit pad width to 0.008" [0.2mm] * Use IPC-7525 Stencil Design Guidelines * Avoid Type 4 pastes, if you can * Slow down your print head to 0.63"/sec [16 mm/sec] * Consider the suggestions on printing by rpereira in the past

tombstones

Electronics Forum | Wed Jan 12 09:30:33 EST 2000 | Jim Schultz

I need your help. I have been battleing tombstoned 0603 resistors for many months now. I have been working on the profile, the placement accuracy of the chipshooter, and the print accuracy. I am writing in the hopes that someone out there has some

Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Mon Jul 12 21:05:06 EDT 1999 | karlin

Hi, I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) Secondly, I need also facing a lo


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