Industry News | 2015-09-03 16:00:34.0
Libra Industries is pleased to announce the promotion of Daniel McMaster to Customer Service Supervisor for its Richardson, TX facility.
Industry News | 2015-10-21 11:33:29.0
Libra Industries is pleased to announce that through the acquisition of ACD, the company has added state-of-the-art design services to its capabilities. At Libra Industries, the printed circuit board (PCB) design process encourages direct communication with the designer throughout the process, utilizing face-to-face visits as well as the latest web-based communication tools, including WebEx.
Industry News | 2016-10-11 19:13:11.0
Libra Industries is pleased to announce the promotion of William Redmon to Design Manager. Based out of Libra Industries’ Dallas facility, Redmon has been with ACD, now Libra Industries, for more than 11 years.
Industry News | 2018-01-16 10:40:31.0
Press Release: YINCAE’S New Reflowable Underfill Material: SMT 160
Industry News | 2017-10-24 17:17:49.0
Techcon today unveiled a new logo and brand identity at The Assembly Show in Rosemont, IL. The brand launch is being rolled out in conjunction with a series of innovative new products from Techcon, beginning with the TS550R Smart Valves Controller, which can remotely control the Techcon pneumatic valve series via mobile or desktop computer, or via intuitive touch screen controls.
Industry News | 2016-08-18 18:54:15.0
Libra Industries today announced that Scott Fillebrown, CTO, will present during the PCB West Conference, scheduled to take place September 13-16, 2016 at the Santa Clara Convention Center in CA. Fillebrown will present “Manufacturability through Design” on Tuesday, September 13 during the morning session.
Industry News | 2017-06-06 10:38:43.0
YINCAE has developed a new innovative, room temperature flow, capillary underfill: SMT 88UL. SMT 88UL is a super-fast flow capillary underfill designed to flow into gaps as small as 10µm at room temperature without pre-heating a substrate.
Industry News | 2017-06-13 09:00:37.0
YINCAE has developed a new, innovative, highly filled, room temperature flow, capillary underfill: SMT 158UL. SMT 158UL is a highly filled capillary underfill designed to flow into gaps as small as 10µm at room temperature without pre-heating a substrate.
Industry News | 2017-01-24 10:55:12.0
BP 256 is YINCAE’s new ball attach adhesive product
Industry News | 2004-08-11 12:34:46.0
Out-of-the-Box, Ready-to-Use Development Platform Speeds Design of Analog Circuits
