Industry Directory | Equipment Dealer / Broker / Auctions
Trading of Used Electronics and Semiconductor Machines and Equipment
The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst
Industry News | 2017-07-26 12:18:34.0
StratEdge Corporation announces its new mobile friendly website: www.stratedge.com. The website provides detailed information about StratEdge's complete line of DC to 63+ GHz packages, proprietary post-fired and molded ceramic technology, and applications with application notes.
Technical Library | 2017-08-31 13:43:48.0
Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Proper optimization of wire bond parameters and machine settings are essential for good yields. Wire bond process can generate a variety of defects such as lifted bond, cracked metallization, poor intermetallic etc. NSOP – non-stick on pad is a defect in wire bonding which can affect front end assembly yields. In this condition, the imprint of the bond is left on the bond pad without the wire being attached. NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes observed and the efforts to address NSOP reduction
Career Center | Greenville, South Carolina USA | Engineering
Process engineer with flip chip and die bonding experience is needed for a well-established company in South Carolina. This is a new position. Relocation is available. BS is required. Send resume as a Word attachment to sfrederick@connectipro.com.
Industry Directory | Manufacturer
CoorsTek Gaiser invented the ceramic bonding tool. Our precision wire bonding tools include ceramic capillaries, wire wedges, ribbon wedges, ceramic/cermet wedges, die collets & vacuum pick-up tools.
Used SMT Equipment | Semiconductor & Solar
Bondtester by DAGE, in good condition. DAGE Series 4000 Bondtester product information. The 4000 bondtester is multipurpose, capable of performing all pull and shear applications. The 4000 bondtester can be configured as a simple bond wire pull
TM230 solderable conductive adhesives are rapid cure, self-filling, self-leveling and self-soldering adhesives which can be used as die attach adhesives for LED, CSP, QFP, among others, to replace conductive adhesives (Ag) or solder materials such as
TM 150 series solderable conductive adhesives is rapid cure, self-filling, self-leveling and self-soldering adhesives which can be used as die attach adhesives for LED, CSP, QFP, and so on, to replace conductive adhesives (Ag) or solder materials suc
Vimic offer Die Collets and Pick-up Tools, manufactured from metallic (nickel alloy, tungsten carbide) and non-metallic (ceramic and high-temp plastic) materials to suit almost any application in bonding process. We can design and manufacture the ti
