Electronics Forum | Mon Nov 15 12:01:21 EST 1999 | Michael Vyskocil
IRSI - Integrated Reliability Corporation? It seems they do'nt have a turnkey solution for post reflow inspection. I only found an inspection on component-(die)-level. Do you have any additional information? Michael
Electronics Forum | Thu May 20 10:00:26 EDT 1999 | Jason Gregory
Please, someone, help! Our board shearer died. Please can someone direct me to where I can pick up a used board shearer? Jason Gregory Process Tech. Tadiran Microwave Networks (281)263-6671 jasong@microwavenetworks.com
Electronics Forum | Wed Sep 23 20:38:30 EDT 1998 | parag
does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap.
Electronics Forum | Mon Dec 29 09:50:58 EST 1997 | Bob Willis
I need to find different sources for tin lead bumped die for demonstrations. I require 3000 parts can any one supply details of suppliers Tel, Fax and Email ?
Electronics Forum | Tue Oct 08 18:49:45 EDT 2002 | alj
SRT is MUD... They have been bought and sold several times and ZERO has been put into R&D. It will die soon...
Electronics Forum | Mon Dec 30 13:52:50 EST 2002 | bcceng
Haran, This problem can also be caused if the BGA package is POPCORNING. Popcorning causes the BGA package to expand below the die, seen this happen so often to customers that try to install BGA's themselves without the proper handling of BGA's. Tha
Electronics Forum | Mon Mar 24 12:15:24 EST 2003 | zaxx007
Hi Kevin, Hepco makes a small unit called a Hepco 3000-2, with the right die set this should be no problem. The unit should retail for around $600.00USD, have a good day. Sincerely, Zack Schmad factory-automation@cox.net
Electronics Forum | Fri May 16 20:55:05 EDT 2003 | jonfox
The term is still valid and used everyday by those in the die placement and "micro"-electronics world. MILS is too hard to understand at that level. Its just easier to say 10 microns than 0.3937 mils.
Electronics Forum | Mon Oct 06 16:52:32 EDT 2003 | Kari
I was out at Photondynamics almost a year ago and saw the ISIS. It was very cool. I could be wrong, but I think photon let ISIS die, instead of selling the technology (as they did with the AOI and X-ray equipment. Bozos.
Electronics Forum | Sat Sep 20 11:24:27 EDT 2003 | Gabriele
Few questions: - wich type of C-CGA ? (CAST or CLASP column to ceramic attach) - column pitch ? - column count ? - capped (with lid) ? or capless (c4 die on top)? - PCB board zize and thickness ? - volume of solder paste ? - Clean or not Clean so
