Electronics Forum | Thu Feb 28 14:32:13 EST 2008 | cyber_wolf
Let me re-state the last part.... The throwing out part is paste dependent.
Electronics Forum | Fri Nov 19 10:14:30 EST 2004 | steve
A customer of mine is having problem. They can't control their humidity. It is very dry. RH averages 28-30%. The water soluble solder paste prints great. But dries out on metal squeegee. Any suggestions.
Electronics Forum | Tue Aug 20 21:46:09 EDT 2002 | davef
Rinse => OSP Coat => Rinse => Dry Hot Air Solder Level: Preclean => Rinse => Flux Coat => Solder Coat => Hot Air Level => Cool => Soft Brush => Post Clean Rinse => Dry Look here http://www.epa.gov/opptintr/dfe/pubs/pwb/ctsasurf/download/pdf/ch2.pdf
Electronics Forum | Thu Jun 19 07:41:25 EDT 2008 | davef
And that's the key thing for an assembler. Who cares if the part is bone dry? Assemblers want to get the part dry enough so that soldering process does not destroy the part, so that he /she can move on to the next issue.
Electronics Forum | Fri Feb 29 07:32:43 EST 2008 | samitokgoz
We have the same problem... We are using water soluable solder paste (Alpha ws609) and it dries out very quick. I don't want to throw out the paste inside the printer, but on the other and I don't want to risk my production by adding flux or alchol o
Electronics Forum | Thu Jan 27 19:14:27 EST 2000 | Dennis
Thanks! It is right that solder paste is somewhat responsible for misssing components in our case. I took a look at the board after placement and I found that component hit the paste, but no where on the board. I guesss dry solder paste (operater pri
Electronics Forum | Thu Feb 12 22:21:08 EST 2015 | shahrat
So what problems you are facing with Mirtec? Can u check coplanarity, less solder, polarity, dry solder,Pads not properly got the heat for 1005 package. Can u also check 0105 components that is surrounded by some tall components? what about false cal
Electronics Forum | Thu Sep 03 07:16:39 EDT 2009 | rocko
When you increase the blade length you have to use much solder paste. As a result, we will dry-out extra quantity of solder paste. If it's not a problem then you can use longer blades, just change/adjust the process parameters.
Electronics Forum | Thu Jan 12 20:11:25 EST 2012 | davef
Isola water pressure. Between a 210°C normal tin lead cycle and a 250°C lead-free assembly cycle, the vapor pressure doubles. Reflow temperature [*C]||Vapor pressure of water [psi] 150||100 200||225 210||260 220||320 230||400 240||480 250||580 300||1
Electronics Forum | Wed Feb 21 16:14:44 EST 2001 | billschreiber
120 degrees F (49 degrees C.), check the fine-pitch apertures for shape distortion (stainless steel has a very poor memory, once it expands, it doesn�t always contract back to the same position). Check for dings and dents. A good stencil cleaning pr