Industry News | 2017-11-16 16:11:00.0
Libra Industries today announced that it has received and completed the installation of a second Omron VT-S730 3D Post Reflow AOI system at its Dallas, TX facility. With the new 3D-SJI combo technology, Libra Industries can easily detect lifted lead, lifted component and component coplanarity, and provide high-quality solder joint inspection.
Industry News | 2017-10-12 15:05:21.0
KIC is pleased to announce the release of its new Vantage network software system. The new software provides a real-time dash-board for thermal processes, accessible anywhere, from any authorized PC or mobile device. The process data is automatically stored in a central location where the engineer can quickly retrieve and share all relevant data.
Industry News | 2019-12-12 05:22:28.0
The emergence of UVLED is a revolutionary change in the UV curing industry. Its constant light intensity, excellent temperature control, environmental friendly and portable, it is widely used in communication, electronics, optics, printing, medical and other fields. UV curing, mainly using mercury lamp irradiation as the mainstream of the production process, not only pollution of the environment, and the traditional UV lamp high energy consumption, short service life.
Industry News | 2019-12-16 21:42:13.0
The emergence of UVLED is a revolutionary change in the UV curing industry. Its constant light intensity, excellent temperature control, environmental friendly and portable, it is widely used in communication, electronics, optics, printing, medical and other fields.
Industry News | 2019-04-03 20:07:41.0
Practical Components is a leading international distributor of mechanical IC samples or “dummy” components that has added a new SMTA Solder Paste Test Vehicle for Miniaturized Surface Mount Technology (SMT) to its array of Dummy Components, Solder Training Kits and PCB Evaluation Kits.
Industry Directory | Manufacturer
Langke Automation Equipment Co.,Ltd(smdmachine.com) is a nation high-tech enterprise which specialized in integrating R&D, production, sales and service for the led high speed mounting machine, reflow oven, solder paste printer...
Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
Industry Directory | Manufacturer
We offer new and quality second user equipment, Service mount pick and place, Universal through hole insertion, Wave solder, Reflow, Screen Print,Inspection
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
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New Equipment | Solder Materials
LOCTITE GC 10 is a halogen free, zero halogens added, no-clean, low voiding, Pb-free solder paste specially formulated to provide added long term stability over a wide range of temperature conditions. The enhanced paste stability created through its
