Electronics Forum: flux and delamination (Page 10 of 35)

OSP and SIR

Electronics Forum | Wed Aug 21 10:26:08 EDT 2002 | stownsend

We are using OSP coated boards and no-clean solder paste. In a few instances, we are seeing increased distortion in an audio circuit. Has anybody seen or heard of surface insulation resistance (SIR) decreasing after reflow on OSP boards? Is it possib

Lead Free and ICT

Electronics Forum | Tue May 09 14:49:57 EDT 2006 | Larry

Hey guys, Anybody having trouble with increased false contact issues in ICT after switching from lead to lead free? Our test guys keep trying to imply that the flux residues are a problem (we're using Alpha EF2202), but as the soldering process eng

Flux Designations and Composition

Electronics Forum | Wed Jul 07 13:43:06 EDT 2004 | microniks

Thank you for helping finding a direction for my answer. I found interesting things on fluxes at this site: http://www.smtinfo.net/docs/Electronic%20Production/25.htm Due to the lack of precise and concise information on the subject, I think I will w

SPC and Wave

Electronics Forum | Thu Jul 14 11:52:16 EDT 2005 | davef

Sure you can use SPC charting on the wave setup parameters to warn of impending problems. Examples of useful points of analysis are: * Dwell * Temperature * Pot analysis Certainly there's a range of other process controls that could be monitored.

Imm Silver and Voiding

Electronics Forum | Fri Jun 23 10:10:15 EDT 2006 | Gman

Some amount of voiding was always seen on sites where solder paste is printed. These voids are much smaller. However the site where a flip chip is flux dipped has never had problems with voiding. Macro voids (and huge ones at that)across the board s

Flux Designations and Composition

Electronics Forum | Wed Jul 07 17:27:48 EDT 2004 | davef

There is a way to post papers [Tons of them have been posted, to date. Look in the "SMT Library" maybe.] Email info@smtnet.com for details.

Flux Designations and Composition

Electronics Forum | Thu Jul 08 13:30:02 EDT 2004 | Daan Terstegge

I would be glad to host your paper on http://www.smtinfo.net. You can email me via the link on my site. Daan Terstegge http://www.smtinfo.net

Lead Free and ICT

Electronics Forum | Wed May 10 00:46:32 EDT 2006 | Chris

I agree! I am using a SAC305 no clean from Alpha. I have noticed that even hand probing with volt meter leads requires me to press very hard on the pads to bust through the flux residue.

Solder Balls and Humidity

Electronics Forum | Thu Aug 23 22:41:54 EDT 2007 | davef

Water soluable fluxes are quite hydroscopic. If you keep RH below 50 percent, solder balling caused by humidity should be minimized.

Solder Balls and Humidity

Electronics Forum | Tue Aug 28 11:12:23 EDT 2007 | grics

This is what I was thinking, but I am being beat up pretty badly by the selective solder. Ambient temperature is anywhere in the the neighborhood of 76 - 80 degrees F. I am not sure of the RH, but I wouldn't think that would be my issue... One of


flux and delamination searches for Companies, Equipment, Machines, Suppliers & Information