Electronics Forum | Fri Sep 13 08:17:13 EDT 2013 | gregp
Hello Action_101, We are pretty much on the same wavelength as far as moving the cut and clinch and leaving the board stationary. It is the first I have heard about the cut and clinch being difficult to work on but you worked on them so your opinio
Electronics Forum | Mon Feb 24 12:41:18 EST 2014 | mi
Depending on what X-Y centroid / CAD data you need, there are different SW I've used to do the job. If you need PCB gerber "artwork" (rounds, rectangles, lines, squares,...geometric figures), you can use GraphicCode GC-Place & such - load the gerber
Electronics Forum | Fri Aug 03 05:13:01 EDT 2001 | mugen
Well none of us, really know whether, this 0805 CAP is really an unsolder/tombstone defect, coz none of us verfied this with, our own eyes *duh* Funny, this only happened for us, on 0402 ~ 0201 SMD.... Check your land-pad design specifications, if
Electronics Forum | Mon Mar 12 14:19:16 EDT 2007 | Grant
no offense Grant--I was designing P & P equipment and vehemently studying > competition when your mother was still wiping your nose...I was just ? >responding to the previous comment about footprint and feeder capacity--for > which there is no equal
Electronics Forum | Mon Aug 16 13:38:35 EDT 2010 | rl
i would like to request some advice on manually dispensing paste for super fine pitch components. first some background. i am a small design house and specialize in sub-miniature prototypes for avionics. so far, i have mostly used stainless steel st
Electronics Forum | Thu Jan 31 14:10:11 EST 2019 | lapskrfc
I’m setting up an RF and mm-wave lab in a university. My idea is to purchase a set of machines using which I can do pcb prototyping, solder pasting, picking and placing the components (the smallest footprint would be 0201), and soldering (oven). In a
Electronics Forum | Mon Jul 26 18:01:30 EDT 1999 | Earl Moon
| Presently protos of micro-bgas (80i/o) pitch .030/.031 | 12BGA per assembly | | The board is a (.062, 4 layers) FR-4 using Dry film | Pads .014inch | Vias within footprint .020inch | Vias to be filled by bottom side(solder side) only .030in dia. F
Electronics Forum | Fri Feb 05 09:22:25 EST 1999 | Dave F
| | | Joni: What is it about your situation with the board/component/process that makes you want to explore alternatives? Dave F | | Dave: In our case the component is placed on metalled footprint which has via holes to transfer the heat via hole
Electronics Forum | Mon Nov 26 14:49:20 EST 2001 | mparker
1. The formula for cubic area (LxWxH) applies to get the expected volume target value. Caution- do not assume the pad surface square are is correct for the part. Do consider the footprint of the device beign placed and its solder requirements to cre
Electronics Forum | Sat Sep 14 12:24:44 EDT 2002 | scottefiske
We need to remember here that as printer manufacturers were enhancing their product lines, miniaturization was quickly being developed in the background. In the last 2 years I was involved in developing and conducting a D.O.E./F.M.E.A in determining
