Electronics Forum | Fri Dec 15 15:59:35 EST 2000 | Hussman
Dave, It will all be about the same - changing atmospheres does not affect your heater output. You may experience some differences in the way your solder joints look (a little duller), but with some of the newer pastes out there, you can overcome i
Electronics Forum | Tue Jan 30 21:14:26 EST 2001 | davef
Suggestions are: * Limit pad width to 0.008" [0.2mm] * Use IPC-7525 Stencil Design Guidelines * Avoid Type 4 pastes, if you can * Slow down your print head to 0.63"/sec [16 mm/sec] * Consider the suggestions on printing by rpereira in the past
Electronics Forum | Wed Dec 15 09:47:31 EST 1999 | Wolfgang Busko
Hi Chris, the same reduction as for fine pitch (10-15%)has decreased the amount of solderballs enormously. Sure, with adequate pad design and good printing equipment and processcontrol you can get the same results but it does no harm as long as you
Electronics Forum | Mon Jul 12 21:05:06 EDT 1999 | karlin
Hi, I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) Secondly, I need also facing a lo
Electronics Forum | Mon Dec 14 13:16:11 EST 1998 | MMurphy
| DO you know of an Industry Standard that describes solder paste geometries requirements? | Check out www.alphastencil.com and select "Stencil Design Guidelines". This will at least give you an idea of how to deposit optimum paste volumes based on
Electronics Forum | Thu May 29 14:35:37 EDT 2008 | rdmundo
Gents, We've been using a round 1:1 aperture for a 5 mils thickness on our stencil design on 0402 and recently, IPC guidelines recommend oblong, homeplate or reverse homeplate. I believed the PCB pad for 0402's area within the recommended size/dimen
Electronics Forum | Tue Sep 16 13:40:20 EDT 2008 | ck_the_flip
Try reductions in the "Y direction". For the SMALL PAD, go from 16-mils to 14-mils, and on the large pad, you can play around with reductions on the 14x24mil pad...or try mesh pattern. You'll be well with area-ratio guidelines with both approaches,
Electronics Forum | Mon Dec 29 07:23:57 EST 2008 | ghenning
Watch out for workmanship specs. I don't believe this is covered under IPC-A-610. You may have to write your own. Alignment of the fixture and coplanarity of the bar and substrate are key. Also, pay close attention to stencil aperture and thicknes
Electronics Forum | Wed Dec 13 16:47:41 EST 2000 | Michael Parker
It is apparent that you have evaporated the flux before you reflowed. You got lucky when the paste slumped and you didn't get major problems elsewhere. A more reliable solution is to adjust the stencil apertures for the part that is experiencing bri
Electronics Forum | Wed Dec 14 08:06:07 EST 2005 | tk380514
Also we have just made a prototype for Wave soldered SMT components D-packs + 0603 + TSSOP�s on the bottom side with THT comp. on the top, the stencil manufacturer gave his personal library of glue stencil openings and adviced on stencil thickness wh
