Industry News: gold and finger (Page 10 of 13)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Vision Engineering’s FREE Electronics Academy Webinar Series to Broadcast: Eliminate Printed Circuit Board Problems and Failure Modes

Industry News | 2018-01-16 11:59:10.0

Vision Engineering has teamed up with industry-expert Bob Willis to broadcast a free Electronics Academy Webinar aimed at identifying the issues affecting PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture. The next webinar, Eliminate Printed Circuit Board Problems & Failure Modes will take place on January 23rd at 2:30 EST.

Vision Engineering Inc.

DEK to showcase product and process innovation at Southern Electronics 2009, Stand 147

Industry News | 2009-01-22 20:22:57.0

The DEK team is inviting visitors to this year's Southern Electronics Show to unlock the potential of their print process with a wide range of advanced technologies. Being held over 11th � 12th February 2009 at FIVE in Farnborough, UK, Southern Electronics will see the mass imaging leader showcase a wide range of Process Improvement Products and Productivity Tools designed to help customers 'expect more'.

ASM Assembly Systems (DEK)

DEK and Maxim SMT Technologies showcase latest innovations at Electronics Next 2010

Industry News | 2010-02-08 12:16:04.0

DEK is preparing to showcase a comprehensive range of advanced technologies and processes at this year’s Electronics Next exhibition in conjunction with the company’s agent Maxim SMT Technologies Pvt. Ltd. Being held in New Delhi over February 24th – 26th, Electronics Next will see the mass imaging specialist demonstrate its state-of-the-art Horizon screen printing platform along with award-winning Productivity Tools from Stand 501.

ASM Assembly Systems (DEK)

Hesse & Knipps, Inc. Opens Second Demo and Applications Lab on West Coast

Industry News | 2012-02-15 20:06:32.0

Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH recently opened a West Coast Demo and Applications Laboratory to provide enhanced applications and field support to customers throughout the western region. The Hesse & Knipps Demo and Applications Lab is located at the company’s manufacturer rep - Chalman Technologies - in Anaheim, CA. Hesse & Knipps also maintains an East Coast Demo and Applications Lab in Sterling, MA.

Hesse Mechatronics

Speed Up Your AOI and X-ray Inspection with Viscom at APEX

Industry News | 2016-02-15 17:53:06.0

Viscom will exhibit in Booth #1763 at the 2016 IPC APEX EXPO. Viscom's applications experts will present the company's new 3D AOI and X-ray developments.

Viscom AG

Speed Up Your AOI and X-ray Inspection with Viscom at APEX

Industry News | 2016-02-17 17:43:57.0

Viscom announced today that it will exhibit in Booth #1763 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Viscom’s applications experts will present the company’s new 3D AOI and X-ray developments.

Viscom AG

Viscom at productronica with outstanding solutions for 3D AOI and 3D AXI

Industry News | 2017-10-12 15:10:33.0

From Nov. 14-17, 2017, at the world's foremost trade fair, productronica 2017, Viscom AG will present its cutting-edge solutions for optical inspection systems with 3D technology under the motto "Solutions for me." Close cooperation with customers and Viscom's decades of expertise have resulted in products that convince with very fast handling, excellent inspection results and the simplest operation. The new developments are focused on the challenges arising from increasing product changes and higher production volumes, miniaturization and Industry 4.0.

Viscom AG

Nordson MARCH MesoSPHERE Plasma Systems Enable Very High Throughput Processing for 3D and Wafer-level Package Assembly

Industry News | 2018-02-01 20:18:01.0

Nordson MARCH introduces the MesoSPHERE™ Plasma System for very-high throughput processing of 3D and wafer-level packaging processes such as fan-in, fan-out, wafer-level, and panel-level -handling wafers up to 450mm and panels up to 480mm. The MesoSPHERE's new, patented W3 three-axis symmetrical plasma chamber ensures that all areas of the wafer are treated equally and uniformly. Tight control over all process parameters gives highly repeatable results.

MARCH Products | Nordson Electronics Solutions


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