Full Site - : gold leads soldering issue (Page 10 of 269)

IPC Provides Input to U.S. House Oversight and Government Reform Committee

Industry News | 2012-06-07 09:26:31.0

Highlights Federal Regulations that Burden Electronics Manufacturers

Association Connecting Electronics Industries (IPC)

Minimum Thickness PCB

Industry News | 2018-10-18 10:56:54.0

Minimum Thickness PCB

Flason Electronic Co.,limited

Application of lead-free solder

Industry News | 2018-10-18 09:34:29.0

Application of lead-free solder

Flason Electronic Co.,limited

New IPC Solder Manufacturing Council Formed

Industry News |

Association Connecting Electronics Industries (IPC)

2002-03-04 07:32:43.0

SMTA Announces International Conference on Soldering and Reliability (ICSR) Program

Industry News | 2012-03-08 22:21:34.0

The SMTA is pleased to announce the program for the 2012 International Conference on Soldering and Reliability being held May 15-18 in Toronto, Ontario, Canada. Following on the very successful 2005 and 2006 International Conferences on Lead-free Soldering, and the SMTA International Conference on Soldering and Reliability held in Toronto since 2007, this conference will bring together the community of soldering and reliability experts. The event will be co-located with the SMTA Lead-Free Academy and the SMTA Toronto Expo.

Surface Mount Technology Association (SMTA)

Conflict Metals: Good Intentions Gone Tragically Bad

Industry News | 2011-05-23 15:41:12.0

It's a script straight out of the movies. Just replace "blood diamonds" with "blood metals" and begin with a scene that demonstrates the tens of millions of dollars in profit flowing into rebel mines in the Democratic Republic of the Congo (DRC), funding criminal networks and perpetrating horrific war crimes. In the movie, the U.S. government comes to the rescue by implementing a law that withholds resources from these groups, breaks the rebel mines and ends the atrocities.

Association Connecting Electronics Industries (IPC)

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)

Basic Soldering Guide – How to Solder Electronic Components

Industry News | 2018-12-08 03:25:54.0

Basic Soldering Guide – How to Solder Electronic Components

Flason Electronic Co.,limited

IPC And NPL Team Up To Solve Industry Process Issues With Free Defect Clinic At IPC APEX Expo 2011

Industry News | 2011-02-09 14:50:49.0

Manufacturing and quality engineers looking for solutions to process challenges will have an additional resource for answers with the new Process Defect Clinic at the IPC APEX EXPO conference and exhibition, April 12–14, 2011, in Las Vegas. Sponsored by IPC and the National Physical Laboratory (NPL), the free clinic will be held in booth 217 on the show floor to assist event attendees with assembly and soldering process problems, RoHS compliance issues, solderability concerns, field failures and other process-related issues.

Association Connecting Electronics Industries (IPC)

Designing a Multilayer PCB Layout

Industry News | 2018-10-18 11:21:46.0

Designing a Multilayer PCB Layout

Flason Electronic Co.,limited


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