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Tecnomec Srl - Electronic Printed Circuit Boards

Industry Directory | Manufacturer

We produce: electronic circuits, pcb, printed circuit boards, ptfe, multilayers, bilayers, flexible circuits, rigid circuits, rigid-flex circuits, teflon or kapton circuits for electronic field. Based in Italy, we export worldwide.

DabianGreen Co,. Ltd

Industry Directory | Manufacturer

DabianGreen is currently to proven technical leader in the area of assembly, testing, packaging of: RFIDs, COBs, SMDs, and all others miniaturized electronics, mechanical - electronic products.

Almit GmbH

Industry Directory | Manufacturer

Almit is one of the leading providers of solder wires, solder pastes and of course lead-free solders, which are also successfully applied in the aerospace industry, in the automotive field but also in consumer electronics.

Würth Elektronik is first PCB producer in Germany receives seal of approval „AEO F, Authorised Economic Operator (Full) “

Industry News | 2011-06-20 21:39:37.0

The status AEO F is an internationally recognised quality certificate granted by the customs authorities, authenticating the company’s secu-rity from manipulation in the supply chain, the traceability of incoming and outgoing goods and a functioning organisation of foreign trade control.

Würth Elektronik GmbH & Co. KG

REStronics Hires in Southwest Territory

Industry News | 2011-11-28 10:12:41.0

The President of REStronics Co. Inc., Ralph Savage, is pleased to welcome Grant Miller to the Arizona and New Mexico territory of this Manufacturers’ Representative company

REStronics

The Michael Ziegler PRIDE Industries Foundation Awarded Generous Grant by the Hearst Foundations

Industry News | 2022-10-20 06:52:41.0

The funds will support the social enterprise's employment helpline for people with disabilities.

PRIDE Industries, Inc.

PCB Rework Technician (Fixed term contract)

Career Center | , | 2018-02-12 15:39:39.0

MR PCB Rework Technician (Intel Contract Employee) Job Description The IMR PCB rework Technician will be responsible for developing thermal profiles for PCB components, identifying nozzles, revision control, updating/drafting rework instructions,

PCB Rework Technician (Fixed term contract)

Career Center | , | 2018-02-13 11:01:27.0

Job Description The IMR PCB rework Technician will be responsible for developing thermal profiles for PCB components, identifying nozzles, revision control, updating/drafting rework instructions, performing soldering workmanship within IPC standards

Data I/O Announces Michael Tidwell as Vice President of Marketing and Business Development

Industry News | 2019-07-18 08:39:37.0

Data I/O Corporation announced that Michael Tidwell will be joining the company as Vice President of Marketing and Business Development. Michael brings a wealth of experience in Software, Security and Product Management. Michael was previously head of Marketing and Business Development at Sansa Security, a leading SW security IP provider that was sold to ARM Holdings. Michael was also head of product marketing at the ARM IoT Services Group. Prior to Sansa, Michael was Vice President of Business and Market Development at BSQUARE Corporation. Michael is a Summa Cum Laude graduate of Georgia Tech with a degree in electrical engineering. He completed a MSEE at the University of Washington.

Data I/O Corporation

Microstructure and Intermetallic Formation in SnAgCu BGA Components Attached With SnPb Solder Under Isothermal Aging

Technical Library | 2022-10-31 17:09:04.0

The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin–lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad.

CALCE Center for Advanced Life Cycle Engineering


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