Applications: Temperature sensors Pressure sensors Precision current sensing Strain gage amplifiers Medical instrumentation Thermocouple amplifiers
Integrated Circuits (ICs) Interface - Drivers, Receivers, Transceivers Applications: Computers Peripherals Modems Printers Instruments
New Equipment | Cable & Wire Harness Equipment
Overview Seal loading station for CrimpCenter. Conveys and orientates loose weather seals and positions them over previously stripped wires. Suitable for all types of seals, including mini and hard-shell seals. Optional seal monitoring (SealCheck). E
New Equipment | Assembly Services
PCB manufacturer---Hitech Circuits Co., Limited is a PCB manufacturer from China and we focus on multilayer printed circuit board; High density PCB /HDI, hard gold board; Flexible board / FPCB; Bergquist Aluminum based board, Aluminium PCB, Aluminum
New Equipment | Assembly Services
PCB manufacturer---Hitech Circuits Co., Limited is a PCB manufacturer from China and we focus on multilayer printed circuit board; High density PCB /HDI, hard gold board; Flexible board / FPCB; Bergquist Aluminum based board, Aluminium PCB, Aluminum
New Equipment | Test Equipment
The Micro Scratch Tester is widely used to characterize adhesion failure of thin films and coatings, with a typical thickness below 5 µm. The MST is also used in the analysis of organic and inorganic; soft and hard coatings. Applications include thin
Double edge splice tape can be used on paper or plastic tape, punched or formed pockets, any cover tape, and come in a variety of widths. It is primarily used for splicing on-the-fly without removing a tape feeder from the pick and place machine. Sel
Nedox coatings are created by the controlled infusion of various polymers within a proprietary nickel alloy plating. Subsequent controlled treatment cycles assure thorough infusion of the surface with polymer material and concurrently increase the ha
CD-ROM Drives CPU Coolers DAT Drives DVD Drives Floppy Drives Hard Drives (Notebook & PC) Keyboards Memory Modules Mice & Other Input Devices Microprocessors / CPUs Modems Monitors Motherboards Network Interface Cards (NICs) Optical Drives Sound Card
Aluminum Wirebonding Gold Wirebonding Gold Ribbonbonding Wafer Bumping Flip Chip Packaging BGA LGA SMT Direct Chip Attach System In Package Hybrid MCM Stacked Die 3D Packaging 3D Memory Rad Hard RF Packaging
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