Electronics Forum | Sun Jan 28 13:26:27 EST 2007 | Sweet Old Bob
Okay you CM haters I don't see anything about the design of the board, other than OSP which is strike one. What is the board size? What is the board thickness? Where is the BGA located on the board? What is your ball to pad ratio? What is your aspect
Electronics Forum | Wed Nov 21 08:45:33 EST 2007 | davef
Rob: You say, "We usually determine our run process based on the heaviest components, and propensity for falling off during the second reflow process. If there's only the one BGA on that side of the board, we'd tend to run that side first." We agree
Electronics Forum | Fri Dec 27 17:40:55 EST 2019 | rgduval
Using no-clean flux will make the boards very difficult to clean. If you can switch to water soluble flux, your life will be much easier. The "icicles" lead me to think that the board isn't getting hot enough in the pre-heat cycle, and/or there isn
Electronics Forum | Fri Aug 30 16:25:21 EDT 2002 | davef
Imm silver holds-up to multiple thermal cycles very well. The things, we guess, are happening to make imm silver tough to solder after heating and sitting are: * Oxidation of the silver. * Reduction of the co-deposited organic anti-tarnish [used in
Electronics Forum | Thu Aug 30 20:35:51 EDT 2012 | davef
A common bottomside heater configuration is IR-Convection-Convection. One of the big advantages of the IR zone is its ability to allow the flux carrier to spread and dry slowly before the board reaches the convections zones, which can blow wet flux c
Electronics Forum | Fri Feb 01 15:09:43 EST 2008 | chef
Don't do it.!!!! Are you nucking futs? Why is pre-bake required? Are you producing in high humidity? Is the package of the device poroues enough to suck in moisture? Think, consider you will not get an even "bake", the outside of the reel will get
Electronics Forum | Fri Mar 26 09:00:19 EDT 2010 | krish_bala
Thank you Graham for the response. The particular BGA that we currently Bake is a Level 3 BGA, which means the BGA will expire in 7 days after removal. We are currently baking the BGAs once a week for the problem described above. These devices are u
Electronics Forum | Mon Oct 03 16:02:55 EDT 2011 | artposada
The machine does not have pre-heating feature. I'm soldering a six-up panel...I've tried putting them a an oven and letting them soak for 20 mins or so at a low temp. But by the time I placed the panel in the machine and manually fluxed the top sid
Electronics Forum | Thu Nov 09 15:11:42 EST 2006 | bschreiber
This link will explain the cause of the delamination: http://www.smartsonic.com/ssonicfaq.html#4 You need to shorten the cleaning cycle and lower the temperature. Provide me with your mailing address and I will send you a sample of our 440-R SMT D
Electronics Forum | Mon Jan 12 13:15:18 EST 1998 | Yves Trudell
In general terms, guidelines for moisture sensitive devices (MSDs) say that you shouldn't put a component through reflow after it has reached its exposure limit with respect to moisture absorption. When using an automated hot air rework tool to remo
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