Electronics Forum | Fri Oct 05 07:46:24 EDT 2001 | george
Specifications of testing force are not fixed, but (incase of wave soldering) the value should be at least 120-150 % of the force the wave. So for small chip components we assume that the force from the wave on the component is about 3 Newton, this m
Electronics Forum | Mon Dec 22 14:15:41 EST 2008 | ck_the_flip
As Emil says, it's 100% the glue! Your paste is not designed to hold parts on at wave solder. Reflow is MUCH hotter than glue, so I doubt you're not adequately heat-curing it. Possibly, the glue cure is "too hot" and maybe making the material brit
Electronics Forum | Tue Aug 04 11:10:22 EDT 1998 | Chrys
| Hi Stoney, | Justin is giving you some good advice, unfortunately these kinda' problems sometimes call for the ol' D.O.E...otherwise, you could be chasing your tail for a while until you figure out exactly what's causing your problems. | Has
Electronics Forum | Tue Feb 08 14:49:23 EST 2000 | Travis Slaughter
I have never tried this and wouldn�t really even want to consider it. Epoxy generally cures at around 160c in a fairly short amount of time, solder paste requires much more time and a peek temperature of about 210c or more in some cases. Curing you
Electronics Forum | Wed Oct 17 10:21:08 EDT 2001 | genglish
Cheers guys for your rapid response, I investigated the problem further today, eventually I cam round to curing the adhesive in a sandwich of microscope slides resting on the PCA in question (hopefully mimicking the heat transfer), the adhesive is sp
Electronics Forum | Thu Oct 26 15:13:16 EDT 2023 | cyber_wolf
Try 3616 or 3609. Both of these become pliable when heat is applied.
Electronics Forum | Thu Oct 05 16:48:41 EDT 2000 | LarryK
Has anyone ever used the circuit repair kits? The type where you can replace a PTH or SMT pad that has been lifted or damaged? It appears that you just select a pad, trace or whatever needs replacing from a panel and heat or glue it onto the board.
Electronics Forum | Wed Dec 06 22:35:05 EST 2006 | davef
Questions are: * When you say, "corner of some board's BGA chips", is it on the top of the package or between the board and the bottom of the package? * If between the board and the bottom of the package, does it span the distance between the board a
Electronics Forum | Thu Jan 31 07:02:00 EST 2002 | martino
The whole process counldn't be easier. The sales reps' try to turn the whole thing into some crazy black art-its not. The stencil supplier will have their own standard 'glue dot' configurations, and 9 times out of 10 these are more than adequate. As
Electronics Forum | Mon Oct 16 11:12:42 EDT 2000 | NLykus
CEM 1 is a laminate base board material. The other boards in the experiment were manufactured using FR4 as the base board material. What I'm leaning towards is that the glass transition temperature "Tg". What do you think? Topside temperatures in
