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JUKI G-Star Fully Automatic Vision Screen Printer

JUKI G-Star Fully Automatic Vision Screen Printer

New Equipment | Printing

Handling M Size board, G-Star is adept at delivering all your business needs. It successfully attains 01005 miniature printing. Through full contact with the stencil, the improved cleaning system ensures that any remaining paste in the mesh will be e

Southwest Systems Technology

This is a demonstration of the YESTech YTX-X3 3D X-Ray inspecting pcbs in production.

This is a demonstration of the YESTech YTX-X3 3D X-Ray inspecting pcbs in production.

Videos

This is a demonstration of the YESTech YTX-X3 3D X-Ray inspecting pcbs in production. This YTX-X3 is available at the Capital Equipment Exchange. https://www.ce-exchange.com/details/?product=7426&pn=YESTech-YTX-X3-3D-X-Ray

Capital Equipment Exchange

An Automatic Surface Defect Inspection System for Automobiles Using Machine Vision Methods

Technical Library | 2020-08-27 01:15:10.0

Automobile surface defects like scratches or dents occur during the process of manufacturing and cross-border transportation. This will affect consumers' first impression and the service life of the car itself. In most worldwide automobile industries, the inspection process is mainly performed by human vision, which is unstable and insufficient. The combination of artificial intelligence and the automobile industry shows promise nowadays. However, it is a challenge to inspect such defects in a computer system because of imbalanced illumination, specular highlight reflection, various reflection modes and limited defect features. This paper presents the design and implementation of a novel automatic inspection system (AIS) for automobile surface defects which are the located in or close to style lines, edges and handles. The system consists of image acquisition and image processing devices, operating in a closed environment and noncontact way with four LED light sources. Specifically, we use five plane-array Charge Coupled Device (CCD) cameras to collect images of the five sides of the automobile synchronously. Then the AIS extracts candidate defect regions from the vehicle body image by a multi-scale Hessian matrix fusion method. Finally, candidate defect regions are classified into pseudo-defects, dents and scratches by feature extraction (shape, size, statistics and divergence features) and a support vector machine algorithm. Experimental results demonstrate that automatic inspection system can effectively reduce false detection of pseudo-defects produced by image noise and achieve accuracies of 95.6% in dent defects and 97.1% in scratch defects, which is suitable for customs inspection of imported vehicles.

Nanjing University

FX Series AOI

FX Series AOI

New Equipment | Inspection

500,000 components per hour Maximum Board Size: 22” x 20” (560mm x 510mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option

Nordson YESTECH

BX AOI - Benchtop Automated Optical Inspection

BX AOI - Benchtop Automated Optical Inspection

New Equipment | Inspection

500,000 components per hour Maximum Board Size: 18” x 20” (457mm x 508mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option

Nordson YESTECH

FX-940 AOI - Automated In-line PCB Inspection

FX-940 AOI - Automated In-line PCB Inspection

New Equipment | Inspection

1.5 million components per hour Maximum Board Size: 20” x 21” (500mm x 525mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option

Nordson YESTECH

Seamark zm X-6600 X-Ray Images Machine for Semiconductor, Packing components

Seamark zm X-6600 X-Ray Images Machine for Semiconductor, Packing components

New Equipment | Test Equipment

X-6600 X-Ray Images Machine for Semiconductor, Packing components for Semiconductor, Packing components A Leader in the Intelligent x-ray Detection Equipment Application Field LED, SMT, BGA, CSP, Flip Chip Inspection Semiconductor, Packing compon

Seamark zm Tech Group

Seamark zm X-6600 X-Ray Images Machine for Semiconductor, Packing components

Seamark zm X-6600 X-Ray Images Machine for Semiconductor, Packing components

New Equipment | Test Equipment

X-6600 X-Ray Images Machine for Semiconductor, Packing components for Semiconductor, Packing components A Leader in the Intelligent x-ray Detection Equipment Application Field LED, SMT, BGA, CSP, Flip Chip Inspection Semiconductor, Packing compon

Seamark zm Tech Group

X-5600 X-Ray inspection Machine for LED, SMT, BGA, CSP, Flip Chip Inspection

X-5600 X-Ray inspection Machine for LED, SMT, BGA, CSP, Flip Chip Inspection

New Equipment | Test Equipment

X-5600 In-line/off-line X-ray inspection NDT system machine for LED, SMT, BGA, CSP, Flip Chip Inspection WhatsApp/wechat/Skype:+86 18779975930 Email: sales25@zhuomao.com.cn A Leader in the Intelligent x-ray Detection Equipment 14 years experience

Seamark zm Tech Group

Senior Assembler

Career Center | Oldsmar, Florida USA | Maintenance,Production

Job Description: • Uses microscope to verify correct part placement and orientation, manually align parts before soldering and perform post re-flow inspection and touch-up. • Able to identify and touch up poor wetted solder joints, solder voids / i

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