Electronics Forum | Fri Sep 25 16:38:56 EDT 2009 | esoderberg
empf issued an excellent study of calculated solder volume in the 90's. It used lotus 123 but is easily used in excel. I have used it for over 10 years. The only thing wrong is with leadless components. the amount of paste required generally is insuf
Electronics Forum | Fri Apr 04 01:39:21 EDT 2008 | slthomas
All of what Dave says is spot on. I suspect that the most likely corresponding defects on your assemblies would be poor wetting and insufficient solder.
Electronics Forum | Thu Apr 26 11:21:26 EDT 2007 | slthomas
Question...when the machine said something was wrong, was it reading something wrong (false failure), or was there a true descrepancy but not one that resulted in a bad connection (bridge or insufficient)? Also, did you perform a DOE on the process
Electronics Forum | Fri Mar 29 10:11:02 EDT 2019 | cyber_wolf
“For a number of years now, work has been proceeding in order to bring perfection to the crudely conceived idea of a transmission that would not only supply inverse reactive current for use in unilateral phase detractors, but would also be capable of
Electronics Forum | Thu Apr 29 17:35:17 EDT 2004 | Shinmoto
Hi there, We place FBGA packages on a lot of our memory modules. Our stencils have .013" square apertures and a .005" foil thickness. We are using a type 4 paste from Senju Comtek. The price difference is not that significant and readily available
Electronics Forum | Fri May 21 15:50:41 EDT 1999 | John Thorup
We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendors
Electronics Forum | Sun Mar 26 19:02:05 EST 2006 | ms
Hi We are running automatic stencil printers, open squeegees, stainless stencil, stainless blades, print speed 25-30mm/sec. We have a frustrating consistency issue printing .37x.3mm apertures on a 45pin LGA (11 pads each side, 1 large ground in mid
Electronics Forum | Wed Oct 25 12:38:05 EDT 2000 | Phil
Hi there!! You know what your QA is doing is right, coz by measuring the solder paste height can avoid the following defects: 1.Insufficient solder 2.Short solder or bridging 3.Solder balls SPC monitoring for paste height checking is required
Electronics Forum | Sun May 23 15:12:59 EDT 1999 | JohnW
| We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendor
Electronics Forum | Mon May 24 13:33:46 EDT 1999 | Dave F
| We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendor
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