Electronics Forum | Thu Jun 25 10:32:51 EDT 1998 | Gary Simbulan
Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection Handboo
Electronics Forum | Fri Apr 03 03:41:04 EST 1998 | Frank J. de Klein
150 secs. On bilayer boards (Cu only at top and bottom) you can typically not reach differences top to bottom bigger then 35-40 C. For multilayers however, the maximum is 15-20 C. If you actively cool a multi- layer at the bottom during the 2nd pass,
Electronics Forum | Thu Aug 23 11:19:40 EDT 2001 | Hussman
Hi delnosa, Sorry about being 10 days late - don't get to the bottom of the page much. I'm working of layering flex circuits sandwiched between FR4 layers. The flex is primarily designed to take the place of interconnects like yours. I work in ap
Electronics Forum | Fri Aug 17 12:07:40 EDT 2001 | davef
We always get pissed-off a preform suppliers when they tell us that we need to do NRE to develop a preform. Is that BS er watt? Ya got this vanilla connector that everyone on the planet uses and we have to pay NRE. It's just a scam. Try Teka Inte
Electronics Forum | Thu Nov 01 17:35:04 EST 2001 | davef
A couple of things: * Don�t do it. Securing both the plastic case and the lead to prevent breaking the case seal is very difficult to do while you reform the lead. Just resell the parts and buy the correct parts. * If you will not listen and insist
Electronics Forum | Thu Jun 13 06:08:57 EDT 2002 | edahi
guys thanks for the suggestions... DaveF, *Changing paste EricD: Yes we are considering that as a point. Because I believe the paste we are using are in syringe packaged and designed for dispensing. We are using an Indium SMQ75 paste and current
Electronics Forum | Tue Apr 13 19:47:05 EDT 2004 | davef
Glue has different mechanical, thermal, and electrical properties than solder. That's why all these very nice no-lead people are furiously trying to gin-up some wacky solder alloy, rather than using glue. Among the papers in the SMTA Knowledge base
Electronics Forum | Wed Dec 15 21:29:34 EST 2004 | davef
We�d say that it�s incorrect that ENIG solderability protection cannot be steam aged. It�s true the immersion tin and silver cannot be steam aged. We believe that most of the issues surrounding the poor performance of ENIG after steam aging is attr
Electronics Forum | Fri Aug 12 13:17:00 EDT 2005 | patrickbruneel
To all smt neters, In many different threads I have tried to bring awareness of the dangers lead free alloys pose to the reliability of solder connections. Many times those warnings have been waved by unscientific reports (from lead free solder manu
Electronics Forum | Sat Dec 10 17:50:10 EST 2005 | Sergei
This is absolutely true. We have spent more than 10.000 man hrs on this, investigating of a fail safe interconnection that need to last more than 50 years in extremely harsh conditions. Tin Whiskers was at our "ten most wanted" list to be solved. Ba
