Electronics Forum | Wed Jul 03 14:08:10 EDT 2002 | gbriceno
I' designing a PCB with SMD components to optimize the land patterns for wave soldering. I find that the IPC-SM-782 land patterns are not robust enough for wave soldering, yielding ramdom skips and bridges. This PCB will also give me insight on sha
Electronics Forum | Fri Feb 20 16:37:55 EST 1998 | Lee Ritchey 3Com
| I have developed a method to increase SMT circuit density | up to 40%. Looking for interested PCB fabricators and | designers for process improvement. Earl, We are always interested and working on new designs. How can we get involved?
Electronics Forum | Fri Aug 23 12:33:37 EDT 2019 | ameenullakhan
Hi , Its CCGA part . with normal PCB pad opening similar to other BGA pad . Yes its very surprising and we are not able to analyze. What exactly went wrong. We have new stencil design for this now. Will run it tomorrow. Will update the results.
Electronics Forum | Fri Feb 20 16:39:51 EST 1998 | Jim Blankenhorn
| I have developed a method to increase SMT circuit density | up to 40%. Looking for interested PCB fabricators and | designers for process improvement. Tell us more. How can it be done and what does it take from a design level. What about solder dra
Electronics Forum | Sat Apr 19 12:00:07 EDT 2003 | modeltech
I am completely new to SMT design and for my next project I plan to use SMT for the first time. Since production volumes of the PCB's will be low, hand soldering is definitely an option, and will be necessary for my prototype PCB assembly. My proble
Electronics Forum | Fri Feb 20 16:34:41 EST 1998 | Jim Humecky Amdahl Corp
| I have developed a method to increase SMT circuit density | up to 40%. Looking for interested PCB fabricators and | designers for process improvement. Earl, What are you doing now. What you're suggesting can't be done without trickery. We've been d
Electronics Forum | Mon May 25 08:37:28 EDT 2009 | d0min0
Hello, recently we changed supplier of the LF BGA, we did corossection and now have doubts... previous BGA specs : pitch 1mm, ball diameter 0.6mm future BGA specs : pitch 1mm, ball diameter 0.4mm on the crossecrion we found that one of the ball seem
Electronics Forum | Sun Oct 09 16:57:30 EDT 2016 | davef
IPC 2222A Sectional Design Standard for Rigid Organic Printed Boards, 5.3 Design Requirements for Printed Board Assembly
Electronics Forum | Mon Oct 23 21:54:03 EDT 2017 | wendymm
Hey, guys. I have decided to make my own PCB boards recently,but confused about which design software to choose. Summarized the info. on the net and other people's recommendation,there's 5 options, Diptrace, Eagle, Circuitmaker 2000, Kicad, and PCB12
Electronics Forum | Mon Jul 01 04:39:49 EDT 2019 | sssamw
yes, You need tell us how the PCB and board designed, size, material, how de-paneling the PCB?
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