Electronics Forum | Tue Jul 25 08:46:50 EDT 2006 | GS
Hello all, I need to learn about Conductive Anodic Filament (CAF). All information about the phenomenon will be appreciated. About IPC TM-650 6-2-25 CAF Resistance Test, where could it be performed in European Lab ? Thanks in advance Regards....
Electronics Forum | Mon Mar 24 10:38:33 EDT 2008 | davef
No standard, but common practice is: IPC-TM-650 Test Methods Manual * Method 2.1.1, Microsectioning, Manual Method * Method 2.1.1.2, Microsectioning, Semi or Automatic Technique
Electronics Forum | Thu Nov 20 04:00:36 EST 2008 | caerleon
Our sub-contractors will be using SMD600. Thankyou all for your replies much appriciated.
Electronics Forum | Thu Jul 23 07:17:22 EDT 2009 | davef
Things that define the expected product from a board fabricator are: * Fabricator's standard process capability statement. * Buyer's purchase document. * Purchase agreement.
Electronics Forum | Wed Sep 02 11:54:34 EDT 2009 | davef
You can determine empirically what will work. * Use ion chromatography [IPC-TM-650 2.3.28] to evaluate the residues and determine if the residues must be removed. * Use energy dispersive spectroscopy for the elemental analysis or chemical characteriz
Electronics Forum | Tue Jan 26 12:25:44 EST 2010 | blnorman
You can try a 5% solution of sulfuric acid. It's used to clean copper foils to IPC-TM-650 method 2.3.15 prior to testing for purity.
Electronics Forum | Fri Jul 16 11:27:57 EDT 2010 | davef
Consider: * Bow & Twist IPC-TM-650; Method 2.4.22 * Previous threads on SMTnet, like: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=54498
Electronics Forum | Mon Aug 09 12:36:19 EDT 2010 | cobar
IPC TM 650- Solderability of Metallic Surfaces http://www.shanelo.co.za/List%20of%20articles/IPC%202.4.14%20Solderability%20of%20Metalic%20Surfaces.pdf
Electronics Forum | Wed Sep 05 17:14:39 EDT 2012 | cpitarys
All that is required is the sample surface area. (LxWx2) Ref, IPC-TM-650. 2.3.26.1
Electronics Forum | Sun Feb 16 20:52:34 EST 2014 | staylorebad
IPC-4552 says it does. It specifically talks about ball grid array (BGA) pads so small feature size is included as valid. Scott
