New Equipment | Rework & Repair Equipment
Specifications: 1.WDS-700 bga rework station 2.Optical alignment 3.Automatic machine 4.MCGS touch screen 5.CE,ISO passed 6.Small size Optical aligment bga rework station WDS-700 automatic mobile phone repair machine for galaxy note 4 emmc
New Equipment | Rework & Repair Services
Specifications: 1.WDS-700 bga rework station 2.Optical alignment 3.Automatic machine 4.MCGS touch screen 5.CE,ISO passed 6.Small size Hottest professional mobile phone repair machine WDS-700 auto bga chipset rework station with free training
New Equipment | Assembly Services
Unique advanced long-time heating system 1. Equipped with high efficiency and energy saving Swedish NI-CR heating tube, radiation power peak wavelength 4 UM, with surface reflector, high thermal efficiency, temperature rise speed, the forced air cir
Parts & Supplies | Pick and Place/Feeders
We have full range of SMT pick and place machine feeder and Nozzle: 1.Nozzle and feeder for Fuji, Juki, Yamaha, Samsung, Siemens, PanasonicCM602, CM402... electric feeder and vibration feeder have a large stock., 2.feeder parts, cutter, filter, g
Used SMT Equipment | Repair/Rework
Metcal APR-5000 BGA/SMD Rework System. Complete with large assortment of BGA/SMD nozzles and full compliment of spares. Fully inspected and total system maintenance/calibration performed on Dec 13. System is like new with low mileage, works perfectly
Used SMT Equipment | Repair/Rework
Metcal APR-5000 BGA/SMD Rework System. Complete with large assortment of BGA/SMD nozzles and full compliment of spares. Fully inspected and total system maintenance/calibration performed on Dec 13. System is like new with low mileage, works perfectly
Used SMT Equipment | Repair/Rework
Metcal APR-5000 BGA/SMD Rework System. Complete with large assortment of BGA/SMD nozzles and full compliment of spares. Fully inspected and total system maintenance/calibration performed on Dec 13. System is like new with low mileage, works perfectly
Technical Library | 2013-01-03 20:27:54.0
Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC) failures under excessive PCB bending. Pad cratering cracks are not detected by electrical testing or non-destructive inspection methods, yet they pose a long term reliability risk since the cracks may propagate under subsequent loads to cause electrical failure. Since the initiation of pad cratering does not result in an instantaneous electrical signature, detecting the onset of this failure has been challenging. An acoustic emission methodology was recently developed by the authors to detect the onset of pad cratering. The instantaneous release of elastic energy associated with the initiation of an internal crack, i.e., Acoustic Emission (AE), can be monitored to accurately determine the onset of both pad cratering and brittle intermetallic (IMC) failures.
The Sniper SMD-7007 combines the reflow operation of the Flo-master with the latest technology in optic and alignment design. It provides absolute control in positioning all ultra fine pitch QFP, CSP, BGA, uBGA, Large Ceramic or plastic BGA devices
Technical Library | 2018-08-22 14:05:42.0
Glass substrates are emerging as a key alternative to silicon and conventional organic substrates for high-density and high-performance systems due to their outstanding dimensional stability, enabling sub-5-µm lithographic design rules, excellent electrical performance, and unique mechanical properties, key in achieving board-level reliability at body sizes larger than 15 × 15 mm2. This paper describes the first demonstration of the board-level reliability of such large, ultrathin glass ball grid array (BGA) packages directly mounted onto a system board, considering both their thermal cycling and drop-test performances.
