Electronics Forum | Sat Jun 12 10:23:18 EDT 1999 | Dean
| How are you inspecting pcbs post-reflow, are you inspecting all or sampling. The type of assembly involved would be mainly chip components with a mix of actives and a few 25mil and under pitch. | If you sample what are your fault rates looking lik
Electronics Forum | Tue Apr 13 04:54:53 EDT 1999 | Charles Stringer
| | DOES ANY ONE KNOW HOW I CAN STRAIGHTEN | | BENT PINS ON A FINE PITCH QFP WITH OUT DAMAGING | | THE CHIP. AT $300 A CHIP I CAN'T SCRAP THEM. | | | I use tweezers and picks. I place the component down on it's backside (legs up) and manually twe
Electronics Forum | Tue Apr 13 12:36:57 EDT 1999 | Scott McKee
| | | DOES ANY ONE KNOW HOW I CAN STRAIGHTEN | | | BENT PINS ON A FINE PITCH QFP WITH OUT DAMAGING | | | THE CHIP. AT $300 A CHIP I CAN'T SCRAP THEM. | | | | | I use tweezers and picks. I place the component down on it's backside (legs up) and ma
Electronics Forum | Mon Sep 28 13:16:58 EDT 1998 | Earl Moon
| | | Does anyone out there have any pictures (jpeg preferred) of solder paste prints - or know where some are available. It will be awhile before our 35mm camera for our 3D scope arrives and I need some for inspection criteria. I need the good, bad
Electronics Forum | Mon Sep 10 17:52:30 EDT 2001 | mparker
Are you doing actual measurements of the dummy parts placements? or are you just doing a visual go/no go check? If doing actual measurements, be sure to use mil inch units of measure rather than mm. Mil will give you more accurate readings. mm force
Electronics Forum | Tue Sep 25 12:50:13 EDT 2001 | mparker
Since you are mostly concerned about the flux and suspect an application issue, you need to do a few things to validate whats going on. 1. Forget about speed of processing, length of time to do the job. Focus on accuracy first, then speed. with that
Electronics Forum | Wed Nov 07 11:56:44 EST 2001 | mparker
Pad spacing is just one element to consider. Your pad spacing is determined by the pitch (center to center distance between the leads). There are several good resources to find the appropriate pitch per device. Search the archives here or refer to th
Electronics Forum | Sat Jan 19 02:25:37 EST 2002 | ianchan
Hi, Have a board run, using 63/37 Water Souble (WS) process. during the reflow setup time, we had unsolder issues on a leadless bump chip carrier (BCC) IC level package. To rectify the unsolder rejects, we adjusted the reflow time from 25-55sec into
Electronics Forum | Wed May 22 13:40:24 EDT 2002 | Hussman69
Boy, I step out for a bit and everybody picks on me (just joking). I believe I may have been off base a bit. Checking every bit of your stencil design is very good - I do that too. I calculate LXWXH and reduce or over print where needed, depending
Electronics Forum | Wed Mar 03 13:33:25 EST 2004 | stefwitt
How well should the fiducial be centered in the teach mode? Consider that you see the fiducial with probably 40 times magnification on the monitor. If you see the cross-hair a bit off center, then this is most likely just by a few hundreds of a milli
