Electronics Forum | Fri Dec 15 05:02:42 EST 2000 | SaiWong
It is not gonna work. Even though you fine tuned the CP3. 0603 is the maximum. The camera design is only for the 0603 maximum. If you use it for 0402. I think at least 60% of the component are gone. Also, there is no 0802 feeder for the CP3. How can
Electronics Forum | Wed Jun 27 11:59:55 EDT 2007 | samir
*Preheat zone *Maximum slope is a time/temperature relationship that measures how fast the temperature on the printed circuit board changes. The ramp�up rate is usually somewhere between 1.0 �C and 3.0 �C per second, often falling between 2.0 �C and
Electronics Forum | Wed Dec 08 09:53:23 EST 2010 | fönsi
Hello Because of the cold weather, we had some troubles with drying out of printed solder paste on the pcb's. The relative humidity in the air declined below of 20%. We have a process window of store the printed board for maximum 24 hours, but with
Electronics Forum | Fri May 15 00:07:38 EDT 2015 | aapsmt
there can be so many different causes. can be component library height issues. step program z axis offsets - i have seen accidental positive values entered so the components are literally dropped onto the pcb haha. but it does depend on the size of
Electronics Forum | Thu Jun 20 15:50:04 EDT 2002 | dason_c
Dave mention b/4 to me, we don't have any industrial standard for the BGA rework. One of my customer request us to bake at 125C for 6 hours b/4 rework. I am lucky and we don't have the component which you are using. I did a evaluation and we found
Electronics Forum | Mon Jul 14 09:41:35 EDT 2008 | davef
Q1. Do we really need to follow the IPC J-STD-001 Solder purity? A1. Yes, you should control impurities in solder. Further information: * "Allowable concentration of contaminating elements in solder: impurities are harmless unless their level goes to
Electronics Forum | Mon Aug 09 08:16:44 EDT 2010 | markhoch
It will most likely hold on. There is a formula that you can use if you're uncertain. It's (weight of the component in grams)/(total pad mating area in square inches) Grams per square inch must be less than or equal to 35 for the component to be mo
Electronics Forum | Thu May 17 03:23:44 EDT 2018 | shuhaib
the D-PACK IC are falling down in primary side while second side reflow soldering. the solder paste volume is ok. reflow time ( TAL ) is less than primary side. but still issue is happening. let me konw how to prove it is DFM issue, because its hea
Electronics Forum | Tue Jul 02 12:10:06 EDT 2002 | fmonette
Dason, Just a word of caution about your experiment. Evaluating moisture content by weight gain is a very simplistic model, based on the assumption that the moisture content is uniform across the package. In fact, recent technical papers have cl
Electronics Forum | Tue Apr 13 14:49:15 EDT 2010 | davef
90%) from the sample, and the bake time and temperature specified herein are minimums. To improve test accuracy, or to prevent heat damage, other bake parameters may be AABUS. 2 Applicable Documents IPC-QL-653 Certification of Facilities that Inspect
