Industry News | 2011-05-10 20:02:11.0
Aqueous Technologies Corp. announces that it is co-hosting a one-day technical workshop with Zestron and Henkel. The event, "Why Clean Electronic Assemblies?," will take place on June 14 and June 16, 2011.
Industry News | 2011-11-20 13:14:27.0
Nordson DAGE has been awarded a Global Technology Award in the category of Test Equipment for its 4000Plus Bondtester Pad Cratering Inspection System.
Industry News | 2012-05-01 19:12:41.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit its 4000Plus Bondtester Pad Cratering Inspection System in Booth #212 at the upcoming Electronic Components and Technology Conference
Industry News | 2013-08-28 13:54:14.0
Ascentech LLC will exhibit the Gensonic UltraSonic Stencil Cleaner and the new Solder Saver at the upcoming SMTA Capital Expo & Technical Forum, which will be held September 10th, 2013 at the Johns Hopkins University/Applied Physics Lab, 1110 Johns Hopkins Rd., Laurel, MD 20723. Show Hours are from 9am-3:30pm.
Industry News | 2017-07-17 19:09:09.0
Nordson DIMA has launched a new web site, www.nordsondima.com. The newly designed site makes it easier for visitors to learn about Nordson DIMA's full line of hot bar reflow soldering, heat seal bonding, ACF laminating, and heat staking solutions. A second website, www.dimadispensing.eu, was updated to cover the dispensing product lines that are exclusively available for the European region.
Industry News | 2018-09-26 16:52:07.0
Practical Components has added the Foresite Umpire 2 Test Board to its extensive line of Dummy Components and Process Evaluation PCB Boards and Kits.
Industry News | 2021-02-24 11:47:14.0
YINCAE is excited to announce that we have developed SMT 158N series, including a non-flow, low temperature slow cure and high purity liquid epoxy underfill and capillary underfill encapsulant.
Industry News | 2021-09-02 05:46:58.0
The Assembly Division of MacDermid Alpha Electronics Solutions will present the paper "Solder Paste for Interconnecting Structured Ribbons on the Back Side of the c-Si Cells" at the upcoming virtual European PV Solar Energy Conference and Exhibition which takes place from the 6th-10th September 2021.
Industry News | 2021-10-18 15:09:32.0
Insituware LLC is pleased to announce that Morgan Miller, Application Engineer, will present during the SMTA International Conference, scheduled to take place Nov. 1-4, 2021 at the Minneapolis Convention Center. Ms. Miller will present: "Correlation of Solder Paste Electrochemical Impedance Spectroscopy (EIS) Measurements to Solder Paste Inspection (SPI) Performance."
Industry News | 2023-08-14 12:12:00.0
SHENMAO America, Inc. is pleased to announce the availability of its PF735-LT201 Low-Temperature Lead-Free No-Clean Solder Wire. This advanced solder wire is designed to meet the evolving needs of the electronics industry, offering exceptional solderability and reliability for low-temperature PCBA soldering and rework processes.
