Electronics Forum | Sun May 31 16:07:25 EDT 1998 | Alain De Bock
Is there anyone who knows what the influence is of the dip-fluxing process on the placement accuracy of a flip-chip. If you perform dip-fluxing after component alignment, the component may be displaced on the nozzle; if you perform component alignmen
Electronics Forum | Mon Dec 13 18:17:44 EST 1999 | Calvin Wong
We have this solder ball & beads around chip components since day one of manufacturing using non-clean process. We managed to eliminate the solder beads around ceramic type chip componenets when we have a slow ramp up of pre heat at solder reflow. Ho
Electronics Forum | Thu Jun 06 15:55:28 EDT 2002 | arzu
I agree with the others and experienced the problem myself this week. Solderballs at the side of the chips. I looked at the board and found that the chip is pressing the paste away too much. This in combination with our quite big pads(and stencilaper
Electronics Forum | Sun Jun 07 09:38:42 EDT 1998 | Bob Willis
If you mean solder beads at the side of chip components then download the FAQs and the process guide on solder beads which may be of interest. The documents are on my web site www.bobwillis.co.uk | We are getting solder balls after reflow of surface
Electronics Forum | Sat Aug 20 13:23:22 EDT 2011 | saju86ece
Hi, We are facing solder ball issue in Chip component of PCB. We had tried DEK parameter setting changes and also reflow setting but still now not yet solve this problem. board details are, 1.Class 2 prodct 2.HASL Finishing Plz advice me what actio
Electronics Forum | Thu Aug 05 11:15:39 EDT 1999 | John Thorup
| | | | | | | | | Hello, | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chip compon
Electronics Forum | Wed Dec 05 18:28:54 EST 2012 | cnotebaert
what type of part is this a micro BGA by chance? there is a mill spec (man I cant remember it right now), I'll get back to you! it provides acceptance criteria for chip/crack/gouges.... if it doesn’t expose the lead frame (inner workings of the devic
Electronics Forum | Tue Dec 19 20:01:41 EST 2000 | Lisa Murphy
Hi, I have recently been asked if I had any information on the voltage capacity of a solder ball. I asked around and did a web search but came up empty handed. Usually people are concerned with the current carrying capacity of bondwires, flip-chip
Electronics Forum | Wed Aug 15 01:46:43 EDT 2001 | Pavel
Hi, could any body tell me the reason for solder beads apperance and how to aliminate them (solder beads are solder balls that are found along chip body). Thanks,
Electronics Forum | Tue Sep 24 23:03:14 EDT 2002 | redmary
we used the ball bonding, just normal chip on board. as I know the the electroless Ni/immersion Au, the gold thickness is about 0.13um at most, what about chemical plating or electrolytic plating? any experience on it, thanks
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