Electronics Forum | Mon Jan 12 14:07:53 EST 1998 | Yves Trudell
I've heard of a series of labels that absorb moisture at different rates and/or change appearance when a specific saturation level is reached. If such labels exist and if they could be correlated to the exposure limits of specific moisture sensitivit
Electronics Forum | Thu Dec 09 10:40:45 EST 2010 | grahamcooper22
MSL 3 means you can have the devices open for a maximum of 168 hours in an atmosphere of less then or equal to 30 C and 60% RH. If the humidity is less then 60% then it means the devices will absorb less moisture in a given time, but even at 40% RH y
Electronics Forum | Thu Mar 18 18:07:21 EDT 2010 | grahamcooper22
Hi, First check what the Moisture Sensitivity Level of the LEDS is....you may need to ask the LED manufacturer. Once you've established it is moisture sensitive then follow latest version of IPC JEDEC 33 spec. for storage of them and drying them if t
Electronics Forum | Wed Jun 18 07:26:42 EDT 2003 | rmurtuza
Do BGA packages absorb moisture to a great extent if kept exposed to an atmosphere of 300C and 60% relative humidity overnight? Should they be backed before reuse. How long can they be kept exposed without the requirement of baking. Are there any spe
Electronics Forum | Fri Jul 10 14:16:06 EDT 1998 | Bob Willis
As Steve said there should not be a problem with cracking plastic components but if you are reaching 180c there will be a problem with secondary reflow on the top side of the board. PCBs flex during wave soldering as they do during reflow if not supp
Electronics Forum | Fri Aug 10 15:46:07 EDT 2001 | davef
Probably, but the fabricator of these components can best respond to this question. The need to bake depends on the component design. J-STD-020 and J-STD-033 [as I recall] relate to moisture sensitive components and define 6 classes of moisture sen
Electronics Forum | Fri Nov 02 08:30:40 EST 2001 | fmonette
For double-side reflow boards, take note that if you have moisture-sensitive components on the first side, you will need to track their remaining floor life up to the final reflow. This is because the reflow process is too fast to effectively remove
Electronics Forum | Mon May 13 10:37:56 EDT 2002 | fmonette
The other important issue relates to moisture sensitive devices (MSD). If you have MSDs on the first side, you need to track the remaining floor life of the components on the partially assembled boards between the first and second reflow. Contrary to
Electronics Forum | Tue Jan 02 14:50:37 EST 2001 | fmonette
Dear Vicki, If you decide to use high temp paste, I suggest that you verify the rating of the components, especially for moisture-sensitive devices which are normally qualified at peak reflow temperatures of 220-235C. The specified floor life will
Electronics Forum | Thu May 06 12:44:13 EDT 2004 | rob_thomas
Intel is very specific in their recommendations regarding moisture sensitivity.Check ou the following link: http://www.intel.com/design/Quality/icstorage/moist_classify.htm They also have plenty of other info in the developer side.They also have a do
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