Industry News | 2010-07-22 17:50:38.0
Smart Sonic unveiled the world’s first ultrasonic stencil cleaning process in 1990 at the NEPCON West Show.
Industry News | 2013-11-14 18:35:01.0
Barry Industries introduces their line of hermetically sealable HTCC Quad-Flat-No-Lead (QFN) packages with air cavity for high frequency applications. These QFN packages are available in six (6) sizes from 3mm to 8mm with standard JEDEC MO-220 footprints.
Industry News | 2009-03-10 16:11:29.0
OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it will showcase a new, expanded range of SN100C products in booth 2564 at the upcoming APEX exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.
Industry News | 2016-09-19 19:58:07.0
The Balver Zinn Group announces that they will exhibit together with LLE Soluciones at the SMTA Mexico Expo & tech Forum on booth #17. The SMTA Expo is scheduled to take place October 5-6, 2016 at the Riu Hotel in Guadalajara, Mexico. Representatives from LLE and Balver Zinn will display the company’s OT2M solder paste, Brilliant B2012 solder wire, SN100C® alloy along with the latest flux technology.
Industry News | 2011-01-14 13:06:07.0
Nihon Superior Co. Ltd. will exhibit in Booth # East 30-14 at the upcoming INTERNEPCON JAPAN, scheduled to take place January 19-21, 2011 at the Tokyo Big Sight in Tokyo, Japan.
Industry News | 2008-03-15 15:22:12.0
OSAKA, JAPAN � March 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., an advanced soldering supplier to the worldwide market, announces that it will showcase a new, expanded range of SN100C products in booth 249 at the upcoming APEX exhibition and conference, scheduled to take place April 1-3, 2008 in Las Vegas.
Industry News | 2008-10-07 20:52:28.0
OSAKA, JAPAN � October 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., an advanced soldering supplier to the worldwide market, announces that it will feature a newly expanded range of SN100C products, which includes new halogen-free solder paste, in booth 402 at the upcoming Mexitr�nica exhibition, scheduled to take place October 21-23, 2008 at the Expo Guadalajara, Hotel Hilton, in Guadalajara, Jalisco, M�xico.
Industry News | 2013-09-10 15:43:26.0
HARTING AG is increasingly using 3-D molded interconnect device (MID) technology for its customers in the automotive and medical technology sectors who demand very high quality.
Industry News | 2011-03-14 17:59:18.0
Nihon Superior Co. Ltd. will exhibit in Booth #259 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2017-10-06 09:35:20.0
The Balver Zinn Group a leading global manufacturer of solder materials, announces that they will exhibit together with LLE Soluciones & Repstronics at the SMTA Mexico Expo & tech Forum. The SMTA Mexico Expo is scheduled to take place October 18-19, 2017 at the hotel Riu Plaza in Guadalajara, Mexico.
