Industry News | 2010-09-14 17:20:46.0
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, has released a video demonstrating the results of an evaluation comparing the wettability and spreadability of SN100C and SAC305 solder alloys on stranded wire.
Industry News | 2011-03-01 16:38:55.0
Nihon Superior Co. Ltd. announces that Keith Sweatman, Senior Technical Advisor, will present a paper titled "The Stability Window and Mechanical Properties of the Interfacial Intermetallic in Lead-free Solder Joints" at the upcoming TMS 2011 Annual Meeting & Exhibition.
Industry News | 2011-04-20 18:05:38.0
Nihon Superior Co. Ltd. has been awarded a 2011 NPI Award in the category of Cored Wire for its SN100C (044) Flux-Cored Solder Wire.
Industry News | 2011-05-16 15:24:12.0
Nihon Superior announces that it has been awarded a 2011 NPI Award in the category of Soldering Equipment for its SN100C (044) Flux-Cored Solder Wire.
Industry News | 2011-05-19 17:44:42.0
Nihon Superior Co. recently was honored with a 2011 Suita Industry Award. The award was presented to the company during a ceremony on May 7, 2011at the main theater in the Suita Cultural Hall as part of the 28th Suita Industrial fair.
Industry News | 2011-08-18 12:44:10.0
Nihon Superior introduces SN100C (551CT), the newest addition to its SN100C lead-free solder series.
Industry News | 2011-09-12 12:59:41.0
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, introduces the new Selector Guide for SN100C Flux-Cored Solder Wire.
Industry News | 2011-09-28 19:37:44.0
Nihon Superior introduces the new Selector Guide for SN100C solder pastes.
Industry News | 2012-01-13 12:58:39.0
Nihon Superior announces that President Tetsuro Nishimura will present two papers at the upcoming SMTA Pan Pacific Microelectronics Symposium, scheduled to take place February 14-16, 2012 at the Sheraton Poipu Resort in Kauai, Hawaii.
Industry News | 2012-02-07 16:20:22.0
Nihon Superior announces that its Senior Technical Advisor Keith Sweatman will present the paper titled “Effect of Cooling Rate on the Intermetallic Layer in Solder Joints” at the upcoming IPC APEX Expo.
