Electronics Forum | Wed Mar 24 23:12:48 EDT 2021 | grahamcooper22
0.66 area aspect ratio...so for example...if the device is 0.5mm pitch QFP, the pcb pad may be 12 thou wide..make the aperture 9 to 10 thou wide...and reduce it's length by 10 % overall compared to the pcb pad.... Depending on device pitch, select ap
Electronics Forum | Tue Aug 21 03:36:41 EDT 2001 | Michael Ford
I would like to introduce you to our TIMMS system. This includes full multi-vendor programming and line balancing support, and can be used as part of an overall total solution for the shop-floor. The TIMMS (Totally Integrated Manufacturing System) i
Electronics Forum | Thu May 20 07:53:55 EDT 1999 | Chris Nuttall
| | We care currently running into problems during our plug via process: | | At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.Thi
Electronics Forum | Tue Feb 16 16:25:18 EST 1999 | Tuffty
| We use both F4G and MCS at the present and we are phasing out MCS. One main reason is that it's platform is not Y2K compliant. F4G is cumbersome and taxes a high overhead on your computer system. We have also found a bug recently when we have hi
Electronics Forum | Tue Feb 04 21:07:16 EST 2014 | sarason
You should ask yourself a bunch of questions before you consider going down this path. The first being where are the bottlenecks in your existing line and is there anything you can do to eliminate or decrease there bottleneckness (made up word). I
Electronics Forum | Sat Oct 02 03:27:52 EDT 1999 | Brian
| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at
Electronics Forum | Sat Oct 02 20:19:19 EDT 1999 | John Dwinell
| | I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Ir
winsouce.jpg)