Electronics Forum: packing (Page 10 of 45)

Moving SMT Line Suggestions

Electronics Forum | Wed Jan 08 10:49:49 EST 2020 | scotceltic

We used Precision installation and services to fully pack up and ship our full SMT, Select Solder and Final Assy equipment from Novi, MI to Mexico. They were very thorough, detailed and we were very happy with the care they took with our equipment.

Die attach with solder paste

Electronics Forum | Wed Aug 28 10:16:12 EDT 2002 | Jim M.

Sam We install a lot of die in the SMT room using same process as SMT parts.Water soluble solder paste is used for attachment of die to ceramic and boards. Biggest problem i found is the adjustment from installing the die in the bonding area. The t

Re: Packaging of moisture sensitive devices

Electronics Forum | Tue Jun 27 17:26:03 EDT 2000 | John Thorup

Hello Christopher You should do just fine without vacuum evacuation of the bag. Just squeeze out any excess air. Just be sure that you use active desiccant (I.E. fresh or baked). This assumes normal environmentals. I suggest that you download the

Re: More moisture-sensitivity ??'s

Electronics Forum | Wed Apr 19 22:45:31 EDT 2000 | Dave F

Rich: You should raise the issue until someone BIG smacks you!!! We were getting deliveries from our distributors and virtually every part number had an opened dry pack. We kept SCAR'n the dudes until they came in and sat down. It took a while ..

Re: Ic's sesitive to moisture

Electronics Forum | Thu Sep 23 10:11:15 EDT 1999 | Earl Moon

Hi All, I'm recently receiving an IC in package for Ic's sensitive to moisture and not in another times, Somebody know how can I know if this Is moisture sensitive or not(which is the rule ?)?. the Ic is a soic14. thanks I appreci

Re: glop top popcorn

Electronics Forum | Wed Jun 23 11:02:09 EDT 1999 | John Thorup

We are reflowing boards that have glop top components mounted on them. Do glop tops have the same moisture sensitivity as fine pitch? Should we be baking the boards prior to reflow? If your glob tops are PBGAs, they are likely very mo

Re: Flat pack leadforming

Electronics Forum | Thu Nov 19 11:59:58 EST 1998 | Dave F

I have a requirement to reform the legs on flat pack devices (en-masse) due to materials handling problems. I am aware of the pitfalls in reworking any IC in this way however I have no choice in the matter. I have found one suitable machine on the

SMT package types

Electronics Forum | Tue Oct 29 15:07:38 EST 2002 | gregp

SOP small outline package, SOIC small outline integrated circuit, VSOP very small outline package, TSOP thin small outline package,TSSOP thin shrink small outline package, QSOP ???, LQFP low profile quad flat pack, VQFP ??? The packages come and go

DEK supports

Electronics Forum | Thu Nov 11 08:06:00 EST 2004 | no gel pig fan

I would definately try to sell the bosses on the Grid-lok over the gel piggies. We evaluated both and wound up buying the Gel (for close to the same money). On an MPM if you put enough gel packs in the vacuum box (to support the board) it holds the b

Cover tape tearing

Electronics Forum | Fri Dec 16 10:25:14 EST 2005 | GS

Hi Liza - polystirene monolayer (blend ?) could be sealed at less presure, ie 35-40 PSI. Temprature could be 165�-170�C. For sure after sealed you shoud make sure the sealing strength (peel strength)should meet min 15-25 N.(bet avg from 25 to 45 N)


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