Industry News | 2020-09-17 12:26:40.0
Today, IPC issued a blog post in support of the FY 2021 National Defense Authorization Act (NDAA) provisions that would bolster the resiliency and security of the electronics manufacturing ecosystem, including printed circuit board (PCB) fabrication and printed circuit board assembly (PCBA), the green-and-gold hardwiring at the core of all electronics systems. These provisions, approved in both the U.S. House and Senate, aim to improve the security of electronics purchased by the Defense Department.
Industry News | 2020-12-01 17:14:52.0
Heralds Design-through-Manufacturing 4.0
Industry News | 2024-03-21 03:57:07.0
Discover our high-precision solder paste jetting machine for accurate and reliable dispensing. Perfect for modern manufacturing needs.
Industry News | 2010-04-10 02:09:54.0
If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.
Industry News | 2019-10-02 16:32:48.0
Nordson ASYMTEK is pleased to introduce its Panorama™ conformal coating line solutions, providing a balance of equipment and process control for optimal efficiency in automated conformal coating.
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2016-10-25 09:47:33.0
Learn about SMT assembly from SME Phil Zarrow in Chicago
Industry News | 2009-11-05 23:30:43.0
NASHVILLE — November 2009 — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that its Rich Brooks, a trained Six Sigma Black Belt, will present “Lean Sigma Methodology for Selecting the Best Fit Cleaning Agent” at the IPC Lean Sigma Conference, scheduled to take place November 17-19, 2009 at the Fiesta Inn in Tempe, Ariz.
Industry News | 2023-11-29 08:23:40.0
Causes of Cracking of Stainless Steel Welded Tube
Industry News | 2019-01-22 08:57:36.0
Seoul, South Korea – Koh Young Technology, the industry’s leading smart factory solutions provider, will highlight latest process optimization solution with its KY8030-3 3D SPI for solder paste printing at APEX show during 29-31 January 2019 at the San Diego convention center. The Koh Young Process Optimizer (KPO) solution is a comprehensive process optimization solution suite, which maximizes throughput and increases ROI by recommending optimal print parameters.