Electronics Forum | Wed Mar 16 14:12:19 EST 2005 | KT
We are moving from ENIG to Immersion Ag. We notice PCB's with Ag finish getting more heat(increase in peak temp) than the ENIG. Any reasoning behind this phenomenon ? KT
Electronics Forum | Wed Mar 16 20:12:12 EST 2005 | bkd
Does anyone knows any vendors that supplies jedec precondition tray that could stand up to 270�C peak reflow temperature.
Electronics Forum | Mon May 09 14:36:49 EDT 2005 | driscolj
We've had similar problems with Indium 6.2 water soluble paste. We reduced our voiding by implementing a longer soak and lower peak temperature.
Electronics Forum | Wed Jul 06 18:11:37 EDT 2005 | russ
Please search the archives as this has been discussed on many occasions. Everything should be fine except for BGAs which will require a higher temp of 235C at the peak in reflow.
Electronics Forum | Thu Sep 08 14:25:20 EDT 2005 | kris
what did you reprofile to ? did you increase the peak reflow temperature ? can you tell form what to where ? I bet your vendor told you process guys that it was " drop in" for a tin leaded plated part.
Electronics Forum | Mon Oct 03 10:20:43 EDT 2005 | davef
Follow your component supplier recommendations. For instance: Xilinx says their lead-free alloy for their BGA spheres is SnAgCu, and liquidous is 217*C and they want you to peak at 230 - 235*C for good wetting according to their reflow guidelines.
Electronics Forum | Wed Nov 30 11:43:15 EST 2005 | russ
You will be fine as long as you don't run BGAs this way. I would imagine that you have already been doing this for some time already. You might need to increase peak temp and or time with some of the lead finishes.
Electronics Forum | Fri Feb 10 12:21:44 EST 2006 | Cal Kolokoy
DaveF is correct in saying that TAL is not the best metric to use in reflow soldering. That is why paste manufacturers give such a wide range; typically 30 to 120 seconds. The peak temperature is more important, especially in the mixed Pb and Pb-F
Electronics Forum | Mon Feb 20 17:11:13 EST 2006 | pjc
From ambient, about 25C, that's to peak overall to about 230C. Dave's got the link to the SMQ 230 sheet.
Electronics Forum | Mon Feb 20 20:57:35 EST 2006 | Cal Kolokoy
The ramp sets the stage for flux activation, and if ramping in a linear fashion, burning off some of the volatiles, but yet preserving the activators. The ramp is also intended to preheat the SMDs to prevent thermal shock. Most solder paste data sh
