Electronics Forum | Thu Mar 16 10:41:34 EST 2000 | Russ
Are we talking midship SMT or wave soldering? SMT - I have found the best method is not having them (WOW) this can be accomplished through pad design, aperture design, placement accuracy, and profiling, It is my understanding however, that these
Electronics Forum | Fri Mar 03 10:07:15 EST 2000 | Wolfgang Busko
Hi Jacqueline, - what a name in this technical world - I just tried the calculator and for example choose the CQFP and then selected other and an input mask appeared where you have to fill in the required data from the components datasheet. I have to
Electronics Forum | Fri Apr 13 14:08:53 EDT 2001 | CAL
Proper setup and cleaning of stencil helps ensure repeatable printing performance. Cleaning processes need to be compatible with materials used in the manufacturing of stencils and solder paste. IPC 7525 should also help you out. We here would Inspe
Electronics Forum | Mon May 14 14:51:36 EDT 2001 | Brian W.
Personally, I prefer the OSP. I get a flat surface to deposit paste on, resulting in more consistent solder paste volumes. With HASL, the amount of plating and the mounding affect the paste deposition. I have even had it affect the placement. The
Electronics Forum | Mon Jul 30 18:07:22 EDT 2001 | mparker
Kenny- there are a few standards by IPC and EIA that address the strength of solder. A pull test (which is a destructive test) will average 1500 PSI per joint. My concern is that you are wanting to increase solder volume for an 0805 component by inc
Electronics Forum | Mon Jul 30 21:31:19 EDT 2001 | kennyhktan
Kenny- there are a few standards by IPC and EIA > that address the strength of solder. A pull test > (which is a destructive test) will average 1500 > PSI per joint. > > My concern is that you are > wanting to increase solder volume for an 0805
Electronics Forum | Mon Sep 21 09:45:17 EDT 1998 | Dave F
| am working on the design of a showboard to demonstrate our | assembly capabilities. we are working with double sided assemblies involving BGAs and CSPs. could someone suggest | types of BGAs/ CSPs (type, name, I/O, etc)that would be a challenge t
Electronics Forum | Wed Sep 26 09:56:50 EDT 2001 | John S
This will probably sound like a dumb question, but... I have a specific 1206 chip resistor that routinely ends up placed upside down on the pcb. We use Juki 750 placement machines. I normally run the machine with the auto-correct for the pick posi
Electronics Forum | Mon Jan 21 15:55:53 EST 2002 | Yannick
The point behind traces and vias on my test is that I don't only want to perform test on printing and placement but on reflow too, so a board with many components and no trace will not react like a board with traces on it. Unless you or someone else
Electronics Forum | Tue Jun 04 20:34:28 EDT 2002 | russ
Jason, Excessive thermal ramp rates, misprints, improper pad design, paste type, placement pressure, all can cause solderballs. Do the pads on this board meet IPC 782 criterias? I have found that too much pad underneath component can cause this. A
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