Electronics Forum | Tue Aug 31 17:36:36 EDT 2004 | davef
NO-LEAD COMPONENTS WITH LEAD SOLDER ISSUE: We agree with Russ. We've dicussed this several times on SMTnet. For instance, look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25394 LEAD COMPONENTS WITH NO-LEAD SOLDER ISSUE: We disa
Electronics Forum | Sun Nov 08 15:27:25 EST 2015 | davef
Thinner: Flux thinner, NOT paint thinner We kept a spare stone in thinner in inventory. We cut PVC pipe to size, cap in one end, screw thread on the other, stone inside, filled with flux thinner and covered with a screw cap. I don't remember who we
Electronics Forum | Tue Feb 16 13:30:20 EST 2010 | asksmt
Hi, I have specified Lead Free Plating for my Four Layer PCB. but the Final Production Solder Process is not Lead free it is leaded Process. My question is will there be an issue if we use Lead free plating on PCB and use leaded solder material fo
Electronics Forum | Wed Apr 06 12:21:14 EDT 2011 | ripper
Hi, I am process engineer in PCBA factory.I have a question about gold plating on BGA.I want to know difference soldering performance between gold plating electrolytic and ENIG.Many thank for any idea.
Electronics Forum | Tue Feb 16 21:29:18 EST 2010 | actioncontrols
I predict you will have no problems with your soldering. Remember that all plating is only a few microns thick and quickly washed away by the molten solder. We have used white tin, immersion gold, OSG, etc. for quite a while with leaded solder and
Electronics Forum | Wed Apr 06 13:43:14 EDT 2011 | mosborne1
ENIG is the way you need to go. With ENIG you deposit a lot less gold. Too much gold will cause soler problems. Matt www.americancircuits.com
Electronics Forum | Sat Oct 24 07:55:55 EDT 1998 | Chuck Garth
I know that this not surface mount, but many of us have to perform multipule duties. Can anyone give me some information on this I am having problems getting relibility getingthe heat seal ribbon to make consistant electrical contact. Any help would
Electronics Forum | Thu Apr 07 02:38:20 EDT 2011 | aungthura
I didn't know the difference for BGA. We found solderability probelm as show in attach.Then, we called to PCB maker and they said that it could be caused because of PCB finishing. Do you agree this probelm was happend because of PCB finishing? Unfor
Electronics Forum | Thu Apr 07 09:04:19 EDT 2011 | mosborne1
First of all you need a new board house. You should quote us http://www.americancircuits.com. This really looks like a poor drilling operation with the blow holes. Blow holes are usually caused by two main problems. Improper drilling and/or moisture.
Electronics Forum | Tue Aug 14 23:58:19 EDT 2001 | Glen Brian
We are using the new auto-dipping machine for LED solder dipping and dragging. The flux is water-soluble flux and the solder is 63/37 at 250 deg. C. Two weeks ago we exchanged the pot with new 63/37 solder. About a week, we found that the high level
