Electronics Forum | Thu Mar 04 10:21:55 EST 1999 | Igmar
Can someone please advise me to the rework procedure for removal and replacing Ceramic Chip Capacitors (e.g. 0805, 1206, etc.)? Is it necessary to pre-heat ceramic capacitors before soldering them onto a PCB with a soldering iron? Is this just a rec
Electronics Forum | Mon Mar 08 16:23:24 EST 1999 | Dave F
| Can someone please advise me to the rework procedure for removal and replacing Ceramic Chip Capacitors (e.g. 0805, 1206, etc.)? | | Is it necessary to pre-heat ceramic capacitors before soldering them onto a PCB with a soldering iron? Is this just
Electronics Forum | Thu Feb 26 16:49:57 EST 1998 | specnor tecnic corp
we have some rebuilt wave soldering systems in stock ready to be shipped. epk-ii smt with lambda wave, chip wave ,omega wave. 4 preheaters,jacking stand roll out computer control. machine is in a great shape. another machin upk15f with 6 preheaters
Electronics Forum | Sat Jan 19 02:29:11 EST 2002 | ianchan
Thanks for the tips... found out the ex-employee guy, had pre-bake conditioning put into the process flow, as this pcb is made of polymide material, that is reputed to have historical patterns in thermal sensitivity. To avoid "thermal damaging" the
Electronics Forum | Wed Mar 05 13:12:33 EST 2003 | msivigny
Hello davide, the biggest advantage you'll find with a complete N2 tunnel is the minimization of oxidation during board preheating. Using only an inerted solder pot allows the oxidation to build up throughout the preheat stages and introduces contami
Electronics Forum | Thu Jul 17 11:34:35 EDT 2003 | pjc
� Center board support: - Stationary tension wire - Adjustable width and height position (manual) - Pneumatic raise/lower feature; extends through preheat and solder wave - Minimum board clearance on bottom preheater #1 is 63.5 mm (2.5 in.) with
Electronics Forum | Thu Jul 31 15:29:25 EDT 2003 | bcceng
A couple of things you can look into 1. The proper bottom pre-heat of board. If you are applying only direct hot air to BGA without preheating can cause BGA's to warp and collapse un-even. 2. Moisture on you BGA's. If BGA's were not properly packa
Electronics Forum | Thu Aug 07 19:48:23 EDT 2003 | Shawn
We do allot of multi layer boards with heavy ground planes or heat sinks attached. We have a Trieber, use RMA flux, solder pot temp at 500F, foam fluxer, spray the top if need be, and would warm up the PWB to around 240F over the preheaters. We have
Electronics Forum | Thu Feb 19 13:43:01 EST 2004 | northern
What would cause this? Too much pre-heat, not enough, too much dwell, not enough? I am staying within the flux specs for preheat and can't seem to affect it much. Can board/parts contamination lead to this? I think that is a reach but I'm runnin out
Electronics Forum | Mon Feb 28 16:04:30 EST 2005 | Alex
I use to have that kind of problems with other type of machines and here are the causes: 1- Spray fluxer head partially obstructed (check flow rate) 2- Defective pre-heater probe (manually check temps) 3- PROFILE (last preheat to 280) 4- we sometimes