Electronics Forum | Tue Jul 24 10:57:12 EDT 2007 | babe7362000
Is there a reason why you want to wash the board > before wave?!?!? > > What is your process > flow? > > I run bottom side of my boards first, > then top just to make it easier to setup (easier > to put those support pins around those smaller
Electronics Forum | Thu Jan 06 06:15:49 EST 2005 | mattkehoe
We need some opinions about a situation that is causing problems in our process. The pcb's in question are .125 thick with a HASL finish. The boards are coming in with a large amount of solder trapped inside the via holes. Sometimes this solder is ac
Electronics Forum | Sun Jul 26 07:52:35 EDT 2020 | sync40
Hello to everyone, Have you ever experienced soldermask bubbles inmediately after printed the soldermask itself? (for screen printing method of LPISM). I am not talking here about blistering or any outgassing defects after exposing to high temperatu
Electronics Forum | Wed Apr 08 11:30:03 EDT 1998 | mpark
Clint, You may want to call KJ Marketing Services, a Canadian company that fabricates plastic laser cut stencil. They call it "Kepoch stencil" This material was originally developed by Dupont, and patented and marketed by KJ. It was available for
Electronics Forum | Wed Apr 08 05:41:37 EDT 1998 | Alan Pestell
We currently use the Loctite system of Glue/stencils and are getting very good results. You may still have a height problem is you solder resist is too thick. The UK sales person is Bob.goss@loctite-europe.com & he may give you more help. The only ot
Electronics Forum | Fri Oct 12 11:18:57 EDT 2012 | srgbarba
Hi, I want to ask if someone saw the combo process at smt lines for panel array (bot & top per both sides), I just perform some experiments and it works perfectly, and I validate the T hus (Cg/Pa) and no one component were dropped after the 2nd reflo
Electronics Forum | Mon Jun 19 21:29:41 EDT 2000 | Jack Hou
Hi, everyone, I'm an new engineer and in charge of SMT process. Now I want to apply DOE to printing process. some questions to ask you guys. 1. how many replications do i need in each run (L8) ? 2. after printing, except solder height, volume, what's
Electronics Forum | Sun Sep 15 09:13:41 EDT 2002 | davef
A near eutechtic alloy [ie, 63/37, 62/36/2, etc] would be fine. People print, place, and reflow millions of cermaic capacitors with these alloys every day.
Electronics Forum | Wed Oct 17 13:02:41 EDT 2001 | Yngwie
We are running Clean process. solder beadings were found after the wash process. Weird eh!! It's true.. Details: 1)wash pressure ? No shadowing effects from high profile component. It also happened on the component's body of the 1210 & 0402 caps whi
Electronics Forum | Wed May 05 06:30:40 EDT 2021 | jineshjpr
Do Proper underneath stencil cleaning. if the cleaning not effective, check Vaccuum section of the printer machine. Else change the Wipe roll. Trying out with other cleaning solvent (dedicated to stencil cleaner) also improve this issues.
