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™ 软件 的 3 点T/C profiling 监测系统 ECD CPK 软件 网带 空气环境制程 无铅制程 可选功能 400° 及 450° 可选 传动系统 氮气选项： 100ppm@<900 SCFH GEN 5 气冷助焊剂分离系统 氮气可改装能力 氮气改装选项 RMATS-远程遥控监测及技术支持选项 ETL/CE 证书 双轨道传动 水冷 GEM/SECs 接口 工业4.0 交流 » 关于Heller Industries公司 » Heller Industries客户支持 上海朗仕电子设备有
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/products/barrels?con=t&page=23
innovations have included advances in thickness profiling, coextrusion, deckling, edge bead control, layer multiplication, and slot die coating DS_EDI_Remanufacturing Polymer Processing Systems
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/division-applications/hot-melt?con=t&page=17
brand celebrates 50 years of global leadership in polymer extrusion and fluid coating dies Polymer Processing Systems EDI® innovations have included advances in thickness profiling, coextrusion, deckling, edge bead control, layer multiplication, and slot die coating Switch to EDI®
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/division-applications/extrusion?con=t&page=2
® innovations have included advances in thickness profiling, coextrusion, deckling, edge bead control, layer multiplication, and slot die coating New Extrusion Coating Die Eliminates Edge Bead and
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/division-applications/extrusion-coating-and-laminating?con=t&page=2
brand celebrates 50 years of global leadership in polymer extrusion and fluid coating dies Polymer Processing Systems EDI® innovations have included advances in thickness profiling, coextrusion, deckling, edge bead control, layer multiplication, and slot die coating Ultraflow™
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/division-applications/sheet?con=t&page=4
brand celebrates 50 years of global leadership in polymer extrusion and fluid coating dies Polymer Processing Systems EDI® innovations have included advances in thickness profiling, coextrusion, deckling, edge bead control, layer multiplication, and slot die coating Much Greater Lip-adjusting 'Stroke' of New-generation
| http://etasmt.com/te_news_bulletin/2021-08-31/23567.chtml
. It is essential that accurate profiling be achieved and thus use of an accurate data recording system as well as a board that has been instrumented properly is imperative
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. It also comes with 2 extra thermocouple ports for profiling. Model HRM-640 HRM-840 Heating zones Upper 6 zones Upper 8 zones Bottom 6 zones Bottom 8 zones Heating tunnel 1938mm 2673mm Dimension L3571*W1200*H1450 L4600*W1200*H1450 Net
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. Profiling Higher melting points shrink the process window dramatically. Eutectic tin/lead solder has a melting point of 183°C with a full liquidus temperature of 205° to 215
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