Electronics Forum: protecting/ (Page 10 of 96)

solder SnPb wire to gold plated IC

Electronics Forum | Sat Apr 14 09:28:58 EDT 2007 | davef

When soldering a component to a board, the solderability protection on the component combines with the solderability protection on the board and the solder to form an alloy. This alloy is unique for that combination of solder and solderability protec

reflow / soldering temperature

Electronics Forum | Thu Apr 05 10:50:08 EDT 2001 | CAL

Per our staff here at ACI......... Higher Temperatures maybe necessary to achieve good solder process results. The alloy formed when HASL coating protects the copper is the same as that when OSP provide protection. Temperatures may be increased to im

Board change and solder not adhereing completely

Electronics Forum | Fri Apr 06 08:27:09 EDT 2001 | CAL

From what you are saying................If I hear ya correctly - There is no "Proctective" on the Pads (OSP, HASL....) You will be hard pressed soldering to bare copper. This can not be right. My suggestion- go polyimide with electroptical connecti

Can we hide extra long pad with solder mask ?

Electronics Forum | Fri Nov 09 16:58:30 EST 2001 | davef

Go for it!!! You were unspecific, but adding mask to a completed board could cause: * Increased paste thickness, if you have double thickness of solder mask. * Wrinkled and lifted solder mask under the component, if the solderability protection of

What is too much silver in a joint

Electronics Forum | Thu Mar 28 14:04:16 EST 2002 | davef

Intermetalic Layer (IL). A compound formed at the interface of two different metals, whose atoms have an extremely high natural attraction for each other, so high, that they do not bond to other elements by any other means. Also, intermetalic compo

Protection of the component in the double Wave

Electronics Forum | Thu Jun 20 14:39:35 EDT 2002 | russ

I use TechSpray Wsol 2204-8SQ. This is a water soluble mask that is very thick and works pretty well for this application. Drying time depends on thickness and you should let it dry at least for a little while prior to running through the wave. Ea

BGA void removal

Electronics Forum | Wed Oct 09 20:52:27 EDT 2002 | davef

Russ, Be careful on how you determine your liquidous point. Sure 205-210�C is fine if your paste and the solderability protection on pads and component leads are near eutectic solder and things worked according to plan, but in real life it doesn't

P&P Machine & ESD Protection

Electronics Forum | Tue Jan 21 10:47:22 EST 2003 | MA/NY DDave

Hi Some companies invest in full ESD protection. Some even have ESD Officiers / Engineers. Floor, Wrist Straps, Foot Straps, Special Shoes, Log in Books, Ionizers inside machines, etc, and training. These are in addition to just the reel and it's

CONCOAT

Electronics Forum | Thu Nov 13 11:49:50 EST 2003 | pbarton

Adam, Not had any experience of the stuff myself but a quick Google reveals that KF1280 is 'Vernis de Protection' (French for Protection Varnish), available in aerosol cans. try this link: http://www.gotronic.fr/catalog/circuits/aerosol2.htm Unless

Soldering to Inconel 600 Alloy

Electronics Forum | Mon Dec 20 21:01:12 EST 2004 | davef

Bare inconel is NOT ment to take solder, because * Nickel develops a tenacious oxide layer that is very difficult to remove since the nature of the oxide is very dense, coherent, etc. * Chromium is difficult to solder. * Iron is difficult to solder.


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