New Equipment | Rework & Repair Equipment
Desktop Reflow Oven For Reballing and Prebumping of SMD Components The new MiniOven-04 is perfectly suitable for a wide range of applications, from small QFNs to very large BGAs. This is due to our extensive selection of stencils and masks for almos
Industry News | 2010-06-30 12:09:49.0
MARTIN will demonstrate the Reball / Prebump 03.1 unit at the upcoming SMTA Ohio Valley Expo & Tech Forum, scheduled for Wednesday, July 14, 2010 at the Doubletree Hotel in Cleveland, OH. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.
Industry Directory | Manufacturer
Ball Grid Array IC Reconditioning, Re-Ball Service, BGA IC Purchase and Resale
Industry Directory | Manufacturer
Majelac Technologies offers quick turn IC assembly services, including open cavity QFN, wafer dicing, die sorting, wire bonding, BGA reballing, BGA assy, prototype assembly, fine pitch wire bonding, and more,
Industry Directory | Consultant / Service Provider
Serves the electronic manufacturing industry in Turkey by representing foreign companies, as well as importing and sales of various products. Designs and manufactures BGA reballing masks.
Industry Directory | Consultant / Service Provider / Manufacturer
Manufacturing SMT Stencil, Reballing stencil. SMT pallet; Wave solder pallet and Engineering Services
Industry Directory | Manufacturer
We are Malaysia Public Listed company subsidiary with capability in BGA, Reworking, Reballing, X-Ray, SMT, 0402 Chip, AI, ICT and F/A. We are ISO 9001 certified with RoHS Compliant and LMW status which is for free tax to service oversea customers.
Industry News | 2010-03-24 13:39:18.0
MARTIN, a FINETECH company, will demonstrate the Reball 03.1 unit in booth #638 at the upcoming IPC/APEX exhibition, scheduled for April 6-8, 2010 at the Mandalay Bay Convention Center in Las Vegas, NV.
Industry News | 2010-05-29 18:57:32.0
MARTIN will demonstrate the Reball/Prebump 03.1 unit at the upcoming SMTA Upper Midwest Expo, scheduled to take place Wednesday, June 9, 2010, at the Sheraton Bloomington Hotel in Bloomington, MN. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.
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