Electronics Forum | Fri Oct 14 16:26:40 EDT 2005 | Lapo
Vb software , try another one !
Electronics Forum | Fri Aug 26 14:15:16 EDT 2005 | David
Where could I find more information regarding the double sided reflow and flux problems with white tin?
Electronics Forum | Fri Feb 17 09:02:21 EST 2006 | russ
proper pad geometries, accurate placement, and good reflow profile. Are you having problems right now?
Electronics Forum | Mon Feb 18 13:11:41 EST 2008 | tonyamenson
Are there profilers that I can use over my leaded and lead-free wave that can also profile my reflow ovens (leaded and lead-free). I'm not that familiar with either but as I learn I can't help but think that there should be something on the market t
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Fri Sep 24 12:02:57 EDT 2004 | Frank
Yes, I can see your problem, the nozzle makes only good contact in the center and so the ends don't make good contact. The ends tend to curl up during reflow. There were two suggestions to solve this. 1) Let the operator push down the labels befor
Electronics Forum | Thu Jul 06 13:36:37 EDT 2006 | SWAG
We've had much trouble with flex circuits. As previously mentioned, you must have local fids for the board or the BGA itself (if panelized). Other troubles we experience are drilled holes for pinned connectors. Unless the PCB manufactur has some w
Electronics Forum | Tue Aug 12 14:49:26 EDT 2008 | awegener
I'm attempting to pick and place a small rivet onto our PCB. The rivet should be attached via reflow solder. The rivet will be used to create a sandwich, holding together a frame and additional circuit board in a package. This part is intended onl
Electronics Forum | Thu Oct 22 11:11:58 EDT 1998 | Hon
Dear all, What are your views on reworking BGA's? I mean, with the BGA going through reflow temperatures four times or more, and with a manual reballing process, wouldn't it raise up a few reliability issues? Would you consider not doing rework on
