Electronics Forum | Mon Mar 28 08:56:26 EDT 2011 | cvoyles
Where you inspect depends on what you're looking for. X-Ray is a fairly specialized piece of gear and doesn't lend itself for example to paste registration or thickness measurement. A laser system is better suited. An X-Ray system would allow you to
Electronics Forum | Sat Jun 08 13:16:06 EDT 2013 | unisoft
Take a look at the Unisoft software ( http://www.unisoft-cim.com ). For over 25 years this software has in use by Electronics Manufacturer CEM/EMS's and OEM's to automate New Product Introduction (NPI). It's perfect for Electronic Contract Manufact
Electronics Forum | Tue Jul 24 09:20:44 EDT 2018 | fugtussey
Note that the TF2800 features a large 7 panel preheater with an adjustable height component that allows you to adjust the height of the IR preheater to get much closer to the board. This feature multiples the power of the preheater exponentially, so
Electronics Forum | Fri Mar 27 12:46:23 EDT 2020 | unisoft
Unisoft has been import gerber only for years to setup assembly, aoi machines, etc. *** Help for Importing GERBER only files for used in programming Assembly, AOI, Test, Selective Soldering machines (X/Y Center, Rot, Part#). Also allows you to cre
Electronics Forum | Fri Mar 08 15:38:38 EST 2024 | tommy_magyar
If you have any kind of inspection, record any faults found. If you've got an RMA process, record any faults found. Should rework and/or RMA's hit unwanted numbers, you may want to include additional inspection in your product documentation during bu
Electronics Forum | Tue Dec 26 12:35:09 EST 2000 | Dave F
Your English is fine. Your assessment that corrosion on a portion of the metalization on the end of a component is causing the tombstoning is reasonable. We've seen that before. Corroded components received from a supplier is not acceptable as an
Electronics Forum | Fri Jan 22 18:54:54 EST 1999 | Steve Gregory
> If you are inheriting a system, you probably don't have a lot of choice, >>but with a little ingenuity, you can pull a Steve Gregory: Grab some duct >>tape, a book of matches, and a videotaped rerun of MacGyver for >>inspiration. HEY! Whaddya mea
Electronics Forum | Tue Sep 14 14:52:22 EDT 2004 | Carol
During processing, the solder in the vias reflows and forms solder balls. PCBs have solder in random PBGA vias from the board manufacturer.The manufacturer says this is a result of the HASL process and is unavoidable. We use HASL finish, multilayer,
Electronics Forum | Fri May 07 17:02:01 EDT 1999 | Earl Moon
| On 1.27mm (0.050 inches) Standard Ball Grid Array's. | The ball size diameter starts at approximately 0.025 inches. | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? | | This
Electronics Forum | Thu May 13 18:36:55 EDT 1999 | Andrew Wulff
| | On 1.27mm (0.050 inches) Standard Ball Grid Array's. | | The ball size diameter starts at approximately 0.025 inches. | | | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? |
