Industry Directory | Consultant / Service Provider / Manufacturer
Vexos USA offers full turnkey electronics manufacturing solutions from printed circuit board assembly to final mechanical assembly, test, box build, and shipping of finished products to Local and Global OEMs in multiple markets.
Technical Library | 2023-02-13 19:23:18.0
Spontaneously forming tin whiskers, which emerge unpredictably from pure tin surfaces, have regained prevalence as a topic within the electronics research community. This has resulted from the ROHS-driven conversion to "lead-free" solderable finish processes. Intrinsic stresses (and/or gradients) in plated films are considered to be a primary driving force behind the growth of tin whiskers. This paper compares the formation of tin whiskers on nanocrystalline and conventional polycrystalline copper deposits. Nanocrystalline copper under-metal deposits were investigated, in terms of their ability to mitigate whisker formation, because of their fine grain size and reduced film stress. Pure tin films were deposited using matte and bright electroplating, electroless plating, and electron beam evaporation. The samples were then subjected to thermal cycling conditions in order to expedite whisker growth. The resultant surface morphologies and whisker formations were evaluated.
New Equipment | Solder Materials
Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it. Both the LF-4300 and the 4300 offer true multi-process capabilities,
Process Capability: Several professional auto Siemens series Siplace SMT placement and the plated-through-hole(PTH) insertion parts, test, package lines Productivity: mount above 1.5million/day SMC components in our SMT production lines Small SMC/
Process Capability: Several professional auto Siemens series Siplace SMT placement and the plated-through-hole(PTH) insertion parts, test, package lines Productivity: mount above 1.5million/day SMC components in our SMT production lines Small SMC/
Three (3) heating zone reflow oven for batch production runs utilizing our patented Horizontal ConvectionTM Heating technology for extremely uniform temperature profiling across the board for enhanced process control. The GF-120HT is lead-free compat
New Equipment | ESD Control Supplies
High humidity is known to cause problems with electronic parts and components, however compliance with RoHS standards has raised awareness of moisture issues and seen a huge increase in the use of moisture barrier bags. Barrier Bags Use of unleaded
Material: nickle silver Thickness: 0.3mm Tolerance: ±0.127mm Packing: shield frame in tape and reel,shield cover in common tray Certificate: ROHS,material data sheet,ISO9001:2015 Delivery time: 20 days for tooling,10 days for mass prod
Material: nickle silver Thickness: 0.3mm Tolerance: ±0.127mm Packing: shield frame in tape and reel,shield cover in common tray Certificate: ROHS,material data sheet,ISO9001:2015 Delivery time: 20 days for tooling,10 days for mass prod
Material: nickle silver Thickness: 0.3mm Tolerance: ±0.127mm Packing: shield frame in tape and reel,shield cover in common tray Certificate: ROHS,material data sheet,ISO9001:2015 Delivery time: 20 days for tooling,10 days for mass prod
