Electronics Forum | Thu Sep 06 05:25:38 EDT 2018 | spoiltforchoice
I'm no expert but I think you will find the majority of discussions around BGA & good printing results focus on the PCB design and things like tented vias and pad definition. e.g https://macrofab.com/blog/bga-pad-creation-smd-nsmd/ After that, work
Electronics Forum | Thu Feb 24 19:58:35 EST 2005 | abhirami
GS, What should be the temperature we should get down to? Is it room temperature? Then it could be quite a long time. Eutectic solders cool down below 183C and may be cooling to 100C should do good? What do you think?
Electronics Forum | Sun Sep 05 12:59:48 EDT 1999 | Dean
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Single sided BGA assy? Or double sided BGA assy (BGA's on both sides)? I have processed double sided (MIrror assy.) bga assemblies and can tell you it is
Electronics Forum | Tue Sep 14 13:36:56 EDT 2004 | C Lampron
Hi Simon, I would recommend a thermal profile on a BGA that is mounted directly over another one. The best way to accomplish this is to drill through the first side BGA to just break through the second side. (assuming you have a board that you can d
Electronics Forum | Sat Jan 23 07:08:54 EST 1999 | Graham Naisbitt
| I have boards coated with Humiseal 1B73. At a late point mfg. site we need to remove a series of 0603 resistors for optioning purposes. I have been trying to determine the fastest, easiest way to re-coat the pads after removal. Drying time of the c
Electronics Forum | Wed Feb 10 08:10:26 EST 2010 | davef
Here is a posting by P Kinner at Humiseal ... Typically, there are three main approaches to avoid coating wicking into press-fit connectors (and other keep out areas). Wicking is a phenomenon caused by a combination of low viscosity of conformal coa
Electronics Forum | Thu Sep 04 06:58:46 EDT 2008 | davef
If you plan to reuse the BGA, you probably should bake the moisture from the component prior to removing it from the board.
Electronics Forum | Wed Sep 17 18:16:28 EDT 2008 | yam6rider
Adam, Most leadfree components can handle only 260C. When you doing the profile, you should put thermocouple on the of the BGA package and to ensure the temp is not go over 260C.
Electronics Forum | Mon Jan 05 03:12:54 EST 2009 | lococost
If you can use a IR desoldering station, you could try covering the second BGA with aluminum tape. The tape shouldnt touch the second BGA, it should form a 'roof'over it that reflects the IR waves.
Electronics Forum | Fri Nov 02 19:02:28 EDT 2007 | yshiau
Hi experts, 1) Do you think a non-operating temperature cycling would do good for screening some marginal BGA joints? 2) If yes, what the exterm temperatures I should go? 3) Any particular profile that is suitable for my need? Thank you!!
