Electronics Forum: simulation (Page 10 of 20)

Interpretation for IPC 600H for Clause 3.3.2 (Lifted Land - Cross Sectioned)

Electronics Forum | Mon Apr 28 02:22:52 EDT 2014 | jkhiew

We found repeated pad lifted after different SMT Reflow temperature (eg: 243 deg C and 233 deg C) at an isolated slot. The PCB Supplier had claimed that such condition is acceptable as per IPC 600H Clause 3.3.2 (Cross Sections) - eg: Acceptable - C

Interpretation for IPC 600H for Clause 3.3.2 (Lifted Land - Cross Sectioned)

Electronics Forum | Mon Apr 28 15:20:50 EDT 2014 | davef

Your customer is correct. Your supplier has clamped some sort of machine to your butt and has plugged it in the wall outlet. Honest mistake: * IPC-A-600H, 3.3.2 Lifted Lands - (Cross Sections) ... pertains to boards that were cross sectioned after t

Visual Inspection Post Reflow

Electronics Forum | Wed Jul 02 02:08:16 EDT 2014 | alexeis

Hi, What types of failures are discovered at specified? Is it the problems of deviations, angles or incorrect component form? Our customers use software tool QPlan to prepare placement programs (SMT SETUP). It includes simulation, automatic correcti

What is a typical SMT placement defect rate?

Electronics Forum | Thu Jul 10 15:03:57 EDT 2014 | alexeis

Hi, An answer to this question is very complex. The amount of components and their type is only one parameter to determine the level of failure. Additional parameters that can influence are: 1. The density components on the card 2. Machine type and

No Go Gauge for AOI?

Electronics Forum | Mon Jun 01 04:35:16 EDT 2015 | buckcho

Hello, I have seen two different ways in two companies - one they do it before start of every batch, the others do it when a program is made. I am a fan of the first one, but it depends on company policy. Its good when you have to make a lot of chang

No Go Gauge for AOI?

Electronics Forum | Mon Jun 01 05:20:57 EDT 2015 | alexeis

Hi, I agree with Buckcho. Further to what was said here, our customers perform preliminary simulations to discover potential problems in production. To do so, they use software tools such as QPlan and QPlace UPD. QPlan automatically detects and fix

Assembleon / Philips

Electronics Forum | Sun Feb 21 09:02:38 EST 2016 | alexeis

Hi, We have developed solution, called QPlan, that is reading CAD (different formats), merging it with BOM (including check of BOM and compare exceptions), comparing with your history library of Assembleon/Philips, simulating SMT process with automa

Who knows SM411 MMI problem (Initializing machine I/F) and How to troubleshoot?

Electronics Forum | Thu May 12 02:17:58 EDT 2016 | cspasol

Thanks Mr. Darby, We already Check All connections of I/F Boards, Restore OS, Change Motherboards and Install Backup for SmartSM files and Install new MMI (SmartSM files). But still same Problem. I have one possible cause in my mind is its MVME3100

assembly with/without TH components

Electronics Forum | Tue Jan 09 17:37:00 EST 2018 | tozitom

The truth is that TH will give you better > mechanical stability. If it is a part where you > risk strip off the pads of SMT connector, don't > make this transition to SMT. If it is a one time > cable plug there and there will be not too much >

assembly with/without TH components

Electronics Forum | Wed Jan 10 04:33:05 EST 2018 | spoiltforchoice

Simulating with what? In developed countries manual labour is expensive but is also still the most common solution to fitting though hole parts, even if the board are then wave-soldered. Mixing SMT and THT on what sounds like a very simple product wi


simulation searches for Companies, Equipment, Machines, Suppliers & Information

Best SMT Reflow Oven

High Precision Fluid Dispensers
2024 Eptac IPC Certification Training Schedule

High Throughput Reflow Oven
Assembly Automation Technology

"回流焊炉"