Industry News | 2018-01-28 19:11:16.0
Inovaxe is pleased to announce plans to exhibit at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. The Inovaxe team will showcase the new SMART MSD storage solution, as well as its new SMART Stencil Storage solution in Booth #1725.
Events Calendar | Wed May 31 09:00:00 EDT 2017 - Fri Jun 02 17:00:00 EDT 2017 | München, Germany
ees Europe 2017
Industry News | 2016-03-18 11:28:35.0
Inovaxe announces that it has been awarded a 2016 NPI Award in the category of Component Storage for its SMART InoAuto Mix part Storage System. The award was presented to the company during a Tuesday, March 15, 2016 ceremony that took place at the Las Vegas Convention Center during the IPC APEX EXPO.
New Equipment | Cleaning Equipment
The Low-cost / Compact Stencil Cleaners Heated wash for cleaning lead-free solder paste, pallets and adhesives 100% Stainless steel construction Two model sizes to conserve energy, use less chemistry and generate less waste Install i
Industry News | 2021-10-04 13:47:02.0
Inovaxe will exhibit during the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021, at the Minneapolis Convention Center in Minneapolis, MN. The company plans to debut new storage technology and showcase its SREX700 Smart Rack, SR200 Smart Rack and MODI Table in Booth #3307.
New Equipment | Cleaning Equipment
A Complete Stencil Cleaning Process - From One Source! Clean solder paste, adhesives and flux residue in one machine Two ultrasonic wash tanks eliminate cross contamination issues Safely clean solder paste at ambient temperature and othe
Industry News | 2022-09-21 08:28:25.0
Inovaxe is pleased to announce that Surf-Tech Manufacturing Corporation utilizes six Inovaxe SR Series Mobile Smart Racks at its facility in Ronkonkoma, New York. A multi-faceted provider of contract manufacturing services since 1989, Surf-Tech delivers BOMs to its Smart Racks to deliver many parts at a time.
Technical Library | 2020-01-15 23:54:34.0
Flexible electronics has significantly advanced over the last few years, as devices and circuits from nanoscale structures to printed thin films have started to appear. Simultaneously, the demand for high-performance electronics has also increased because flexible and compact integrated circuits are needed to obtain fully flexible electronic systems. It is challenging to obtain flexible and compact integrated circuits as the silicon based CMOS electronics, which is currently the industry standard for high-performance, is planar and the brittle nature of silicon makes bendability difficult. For this reason, the ultra-thin chips from silicon is gaining interest. This review provides an in-depth analysis of various approaches for obtaining ultra-thin chips from rigid silicon wafer. The comprehensive study presented here includes analysis of ultra-thin chips properties such as the electrical, thermal, optical and mechanical properties, stress modelling, and packaging techniques. The underpinning advances in areas such as sensing, computing, data storage, and energy have been discussed along with several emerging applications (e.g., wearable systems, m-Health, smart cities and Internet of Things etc.) they will enable. This paper is targeted to the readers working in the field of integrated circuits on thin and bendable silicon; but it can be of broad interest to everyone working in the field of flexible electronics.
Industry News | 2013-11-13 13:57:49.0
Storagesolutions announces that it was awarded a 2013 Global Technology Award in the category of Storage Systems for its ACS2000 intelligent automated storage system.
Industry News | 2012-06-12 13:07:13.0
ABB Semiconductors in Lenzburg, Switzerland, long searched for a suitable production storage system for HiPak IGBT modules production. Project Manager Prabath Lewdeni found the SMD Tower by chance. Its supplier Essemtec re-engineered the SMD component storage system into clean room storage for ABB.
