Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
Electronics Forum | Mon Jun 19 21:29:41 EDT 2000 | Jack Hou
Hi, everyone, I'm an new engineer and in charge of SMT process. Now I want to apply DOE to printing process. some questions to ask you guys. 1. how many replications do i need in each run (L8) ? 2. after printing, except solder height, volume, what's
Electronics Forum | Fri May 26 20:37:15 EDT 2000 | Chua
Hi, I'm had transfer to process engineer and I would like to find some information on SMT/AI process trouble-shooting information. Where can I find this information. Can it be find in webside or any books. Thanks.
Electronics Forum | Sat Jun 13 07:25:30 EDT 1998 | Toni Casas i Pujadas
We are very concerned about microcracking in SMT P&P process. I want to know something about: What is microcracking? When did it occur? What are the causes? How can avuid this phenomena?
Electronics Forum | Mon May 24 12:40:50 EDT 1999 | Deon Nungaray
| Hi everyone. My name is Martin Benites from LIma, Peru. I am actually working on a project for automate PCB assembly process in our industry. Actual process is hand-based, thus our startpoint is zero equipment. | I have already asked some companie
Electronics Forum | Thu May 20 10:45:43 EDT 1999 | Nancy V
| Hi everyone. My name is Martin Benites from LIma, Peru. I am actually working on a project for automate PCB assembly process in our industry. Actual process is hand-based, thus our startpoint is zero equipment. | I have already asked some companie
Electronics Forum | Thu May 20 10:46:53 EDT 1999 | Nancy V
| | Hi everyone. My name is Martin Benites from LIma, Peru. I am actually working on a project for automate PCB assembly process in our industry. Actual process is hand-based, thus our startpoint is zero equipment. | | I have already asked some comp
Electronics Forum | Thu Sep 10 15:29:15 EDT 1998 | matthew park
Tim, What is it? Which ones are you talking about: 0.080" vs 0.008", 0.100" vs 0.010", or 0.050" vs 0.005" pitch devices . If you are saying 0.080",0.100" and 0.050", any pick and place machine can handle that. Well if not, one machine that is ca
Electronics Forum | Wed May 27 13:42:08 EDT 1998 | Chrys
| R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recommen
Electronics Forum | Wed May 27 14:35:52 EDT 1998 | Justin Medernach
| | R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recomm
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