Electronics Forum | Tue Aug 21 21:39:19 EDT 2001 | davef
1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? Probably the same reason NC is the preferred process for mounting non-area array SMT components. 2) why is water-soluble (WS) not a hot choice? There�s not reason not to use
Electronics Forum | Tue Dec 04 08:34:07 EST 2007 | davef
We no advice to give you on the topic, but maybe while you're waiting for others to reply, reading a trade journal article on the topic might help. Below is a link to "Pin-in-hole reflow (PIHR) and lead-free solder joints" by David Bernard, Bob Willi
Electronics Forum | Mon Apr 23 16:27:28 EDT 2007 | davef
"If you wanna get a "warm n fuzzy" that your cleaner is capable of doing the job. One thing you can do is what I was taught when selecting a cleaner to buy, is get yourself some glass plates (heat resistant tempered glass to be sure!) and make yourse
Electronics Forum | Wed Jul 29 17:43:26 EDT 1998 | Steve A
| Hi, good friends | I found this site is so wonderful to learn SMT techniques meaningfully. | We now employ 3 Fuji GL-541 dispensors and raw material with Soma IR-120. but we found glue string casually. From my experience from trouble-shooting the c
Electronics Forum | Thu Jun 24 19:14:44 EDT 1999 | Mike Konrad
Very good questions Bob� Given the fact that my company is a manufacturer of batch cleaning equipment, I will speak more in general terms rather than in specific terms. There are several criteria used in the evaluation of batch aqueous cleaning sys
Electronics Forum | Mon Mar 25 21:50:10 EST 2002 | davef
Some of this was copped from Fred. There are numerous package types that now fall under the rubric of land grid array [LGA]. Land grid devices [ie, Bumped Chip Carrier� [BCC], LGA, Quad Flat-pack No-lead [QFN], MicroLeadFrame�, etc] are essentially
Electronics Forum | Mon May 29 02:15:06 EDT 2000 | Dreamsniper
Hi Buddy, We've tried shifting to this process before and from our point of view here are some of the advantage and disadvantages that we discovered. Advantage 1) Cheap Equipment cost as you just need to use your Solder Paste Printer rather than buy
Electronics Forum | Sun Jun 27 12:24:43 EDT 1999 | Scott Cook
| We are anticipating switching from RMA to OA flux for both reflow and wavesolder in the next few months. If you use a batch cleaner running DI water only I would like to hear your experiences. How is it for cleaning under low standoff components
Electronics Forum | Fri Jul 20 10:44:56 EDT 2007 | gmoritz
If you bought it from an equipment dealer ... OK, the dealer has come through and is (allegedly) sending a full compliment of documentation to arrive by Monday. > ... they need weekly maintenance ... > ... you WILL need parts for it. ... > Do you
Electronics Forum | Fri May 26 05:54:40 EDT 2000 | Sal
For the past year now we have been printing adhesive with no real problems. Our printing ranges from 0603's to SOIC using a variation of aperture sizes and metal thickness foils. The crucial parameters are : aperture sizes : These obviously depend o
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