Industry News: solder and ball and gap (Page 10 of 16)

Selective Soldering and Vacuum Reflow from the Technology Leader at NEPCON South China

Industry News | 2021-07-27 15:49:00.0

BTU International, Inc. today announced plans to exhibit at NEPCON South China, scheduled to take place Aug. 25-27, 2021 at the Shenzhen International Convention & Exhibition Center, booth number 1P45. BTU will showcase the new Valence 3508 selective soldering system and PYRAMAX™ Vacuum Reflow Oven.

BTU International

Kester Introduces EnviroMarkTM 919G Lead-Free Solder Paste Halogen-Free and No-Clean at Productronica 2007

Industry News | 2007-11-01 20:33:22.0

ITASCA, IL � November 1, 2007 � Kester announces it will launch the new EnviroMark 919G (EM919G) lead-free solder paste in Hall A4, Stand 363 at the upcoming Productronica 2007 exhibition and conference, scheduled to take place November 13-16, 2007 at the Munich Trade Fair Center in Munich, Germany.

Lloyd Doyle

Indium Corporation to Showcase GalliTHERM™ Liquid Metal Technology and No-Clean Semiconductor Flux at SEMICON Taiwan

Industry News | 2022-08-14 14:12:26.0

Indium Corporation® is proud to feature its cutting-edge soldering and thermal materials at SEMICON Taiwan, September 14-16, in Taipei, Taiwan.

Indium Corporation

The benefits of hard oxidation treatment of wave soldering mahcine and reflow oven guide Rail

Industry News | 2018-10-18 08:05:54.0

The benefits of hard oxidation treatment of wave soldering mahcine and reflow oven guide Rail

Flason Electronic Co.,limited

BTU International and Hentec/RPS Win Best Emerging Exhibit at NEPCON South China

Industry News | 2021-11-01 18:00:38.0

Valence 3508 features an electromagnetic solder pump, unmatched thermal capability, rapid programming, and simplistic elegance in operation.

Hentec Industries, Inc. (RPS Automation)

Nordson's Solutions for SMT Technology and Electronics Manufacturing Demonstrated at NEPCON ASIA 2021

Industry News | 2021-11-03 13:30:59.0

Products for conformal coating, dispensing, plasma treatment, curing, selective soldering, and X-ray inspection were showcased

Nordson Corporation

Bob Willis PoP and BGA Inspection Webinars sponsored by Nordson DAGE

Industry News | 2010-08-27 07:25:03.0

Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers.

ASKbobwillis.com

OK International will showcase assembly and rework technology advances at IPC/ APEX EXPO 2011

Industry News | 2011-03-17 17:48:27.0

The OK International team will display and demonstrate its full range of soldering and production assembly technologies at this year’s IPC/APEX Expo in Las Vegas, April 12-14. These industry-leading solutions will be fully operational at booth # 1634, including advanced soldering, desoldering and rework systems, programmable pre-heaters, fume extraction and a comprehensive range of dispensing technologies.

OK International

FCT Assembly to Showcase Proven Solder Paste and Stencil Technologies at SMTA International 2011

Industry News | 2011-09-21 13:59:11.0

FCT Assembly announces that it will showcase its new line of no-clean, halogen-free solder pastes along with its latest stencil technologies in Booth #206 at the upcoming SMTA International Conference & Exhibition.

FCT ASSEMBLY, INC.

See FCT Assembly’s Best-in-Class Solder and Stencil Technologies at the 2012 IPC APEX Expo

Industry News | 2012-01-24 16:23:30.0

FCT Assembly will showcase its new line of no-clean, halogen-free solder pastes along with its latest stencil technologies in Booth #612 at the upcoming IPC APEX Expo.

FCT ASSEMBLY, INC.


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