Electronics Forum | Thu Nov 17 20:23:14 EST 2005 | cangly
Hi Russ, We control the gravity of flux each 8 hours and will mix thinner to balance it if any.. Do we need more any action for this.. Thanks for your advices.
Electronics Forum | Fri Nov 18 08:31:09 EST 2005 | jdengler
This is way too long of a time. The SG probably changes significantly over this time. This could be a major contributor to your problems. Jerry
Electronics Forum | Thu Nov 17 08:57:39 EST 2005 | russ
No clean and foam fluxing is not a very good process from my experience. I know that the flux manufacturers claim that they are suitable but I am not sure what "suitable" means. I would bet that you have very inconsistant flux coverage. How often
Electronics Forum | Thu Nov 17 21:46:48 EST 2005 | C. Kolokoy
With DIP type components, a sub-par fluxing method (foaming a no-clean), and a chip wave where one is not needed are formulas for bridging and insufficient wetting. If you have SMD's on the wave solder side of the board greater than 0603, and no SOT
Electronics Forum | Thu Jul 06 03:43:22 EDT 2017 | jamesbarnhart
Electronic devices required higher speed, I/O capability, and density to meet standard requirements. Automated robotic soldering solutions that meet the demands of applications are too challenging for hand soldering. Manual soldering, even with the m
Electronics Forum | Wed Jun 21 11:30:27 EDT 2017 | ranap121212
but we do not have laminate preheating on robots. There is no flux separate application, the flux is in the soldering wire
Electronics Forum | Thu Jun 22 09:50:48 EDT 2017 | capse
Are you using nitrogen in your soldering process?
Electronics Forum | Tue Jun 20 15:08:30 EDT 2017 | ranap121212
Hello I have the problem with selective soldering on the robot. Thin balls appear on the laminate. The tin sometimes shoots...? and then the balls are a few millimeters from the soldering point. I tried up or down with temperature, but it did not wor
Electronics Forum | Mon Dec 17 10:46:04 EST 2007 | realchunks
First of all, more info is needed. Solder shorts can be caused by much more than flux. Is the solder short always in the same spot or all over the place? More detail please.
Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F
Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is